| Allicdata Part #: | ATS24904-ND |
| Manufacturer Part#: |
ATS-15A-170-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15A-170-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are essential components for many applications including cooling electronic devices, computers, and more. The ATS-15A-170-C2-R0 is one such example of a Thermal - Heat Sink. This article will take a closer look at the application fields and working principles of the ATS-15A-170-C2-R0.
The ATS-15A-170-C2-R0 is a thermal-heat sink designed to dissipate large amounts of heat in a short time. It features a large heat sink aluminum baseplate with an effective thermal conduction area of 170 mm². The baseplate is designed with contoured fins for improved surface area contact, and is suitable for use with heat generating components with different power ratings, making it an ideal choice for both industrial and commercial applications. The ATS-15A-170-C2-R0 also features a variety of mounting options such as clip-in and screw-in mounting for easy installation.
The ATS-15A-170-C2-R0 utilizes a three-stage thermal working principle. The three stages are the absorption stage, the spread stage, and the heat dissipation stage. The absorption stage begins when the heat generated by the component is absorbed by the base plate of the ATS-15A-170-C2-R0. The heat then spreads out from the base plate to the contoured fins, increasing the surface area contact and allowing the generated heat to be dissipated more effectively. In the heat dissipation stage, the contoured fins of the ATS-15A-170-C2-R0 allows the generated heat to be quickly dissipated into the surrounding environment, helping maintain optimal temperature levels.
The ATS-15A-170-C2-R0 is an ideal choice for a variety of applications that require effective heat dissipation. It can be used to cool a variety of components including CPUs, GPUs, and multi-core processors. It is also suitable for use in industrial, commercial and consumer products such as gaming consoles and electronic devices. Furthermore, it is also suitable for heat generating components with different power ratings, allowing it to be used in applications with different cooling requirements.
In conclusion, the ATS-15A-170-C2-R0 is a Thermal-Heat Sink ideal for applications requiring effective heat dissipation. It features a large aluminum base plate with contoured fins for improved surface area contact, and also features a variety of mounting options for easy installation. The ATS-15A-170-C2-R0 utilizes a three-stage thermal working principle, which is effective in quickly dissipating generated heat. It is suitable for a variety of applications and components, making it an ideal choice for cooling CPUs, GPUs, multi-core processors, and more.
The specific data is subject to PDF, and the above content is for reference