| Allicdata Part #: | ATS-15A-77-C1-R0-ND |
| Manufacturer Part#: |
ATS-15A-77-C1-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15A-77-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction to ATS-15A-77-C1-R0 Thermal - Heat Sinks
The ATS-15A-77-C1-R0 Thermal - Heat Sink is a reliable solution for controlling and dissipating housing heat away from sensitive components such as CPUs, GPUs, analog switches and other mission-critical components.
The ATS-15A-77-C1-R0 Thermal - Heat Sink is designed for use in low-profile applications with a low-friction, lightweight, and easy-to-mount design. Utilizing a high-efficiency thermoelectric material combined with an ultra-compact thermal management system, the ATS-15A-77-C1-R0 helps to cool down sensitive components, while allowing for uninterrupted and reliable computing performance.
Application Fields of ATS-15A-77-C1-R0
The ATS-15A-77-C1-R0 Thermal - Heat Sink is designed to control and dissipate heat away from sensitive components and can be used in various application fields, such as:
- Electronics and Telecommunications
- Computer Operating Systems and Servers
- Auto Electronics and Robotics
- Data Monitoring and Storage
- Medical Devices
- Industrial Automation Devices
- AV Devices and Appliances
The Working Principle of ATS-15A-77-C1-R0
The ATS-15A-77-C1-R0 Thermal - Heat Sink works by transferring the generated heat from the component’s heat source (such as CPU or GPU) to the heat sink via thermal conductivity. This thermal conductivity is achieved by the application of a thermoelectric polymer composite, which is bonded to the heat sink. The heat sink then dissipates the heat, using a combination of convection and conduction.
The unique design of the ATS-15A-77-C1-R0 Thermal - Heat Sink allows for a low-profile design with high thermal performance. This performance is delivered to the components by using highly efficient thermoelectric materials that take the generated heat from the component’s heat source and transfer it to the heat sink via thermal conductivity. The heat sink then dissipates the heat away from the sensitive components, ensuring a steady and reliable computing performance.
The ATS-15A-77-C1-R0 Thermal - Heat Sink also features an easy-to-mount design that is light and dustproof. The lightweight design makes mounting and dismounting easy, and the dustproof design helps protect the heat source from contamination.
Conclusion
The ATS-15A-77-C1-R0 Thermal - Heat Sink is a reliable solution for controlling and dissipating heat away from sensitive components. Utilizing a high-efficiency thermoelectric material combined with an ultra-compact thermal management system, the ATS-15A-77-C1-R0 provides high thermal performance and is suitable for a wide range of application fields. Additionally, the easy-to-mount design of this solution makes it a great choice for low-profile applications.
The specific data is subject to PDF, and the above content is for reference