ATS-15B-10-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-15B-10-C1-R0-ND

Manufacturer Part#:

ATS-15B-10-C1-R0

Price: $ 3.58
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-15B-10-C1-R0 datasheetATS-15B-10-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.24891
30 +: $ 3.16113
50 +: $ 2.98557
100 +: $ 2.80993
250 +: $ 2.63428
500 +: $ 2.54647
1000 +: $ 2.28304
Stock 1000Can Ship Immediately
$ 3.58
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.87°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks

Heat sinks are used to improve the thermal performance of electronic equipment by dissipating heat away from delicate components and into the surroundings. The ATS-15B-10-C1-R0 is a particular type of heat sink used for applications requiring space efficiency and low-cost manufacturing processes. In this article, we will discuss the application field and working principle of the ATS-15B-10-C1-R0.

Application Field

The ATS-15B-10-C1-R0 is a finned aluminum heat sink designed for use in LED lighting, consumer electronics, telecommunications systems, and other applications. Its low profile and lightweight construction make it ideal for applications where space is at a premium, such as compact spaces inside enclosures or recessed areas. Its integrated fins provide additional cooling surface area to improve thermal performance and make it suitable for applications with higher heat dissipation requirements. The ATS-15B-10-C1-R0 is also designed for high cost effectiveness, making it suitable for use in low-cost, mass-produced products.

Working Principle

Heat dissipation from a surface to the environment typically occurs through two mechanisms: conduction and convection. The ATS-15B-10-C1-R0 takes advantage of both of these mechanisms to maximize heat dissipation. Its aluminum construction and integrated heat fin design provide a larger surface area for improved heat conduction, while its integrated fan allows for efficient air convection to carry heat away from the device. As hot air rises, it is drawn away from the device and replaced by cooler air, allowing for effective heat dissipation from the device.

The ATS-15B-10-C1-R0 also features advanced thermal energy management features, such as temperature-controlled fans and adjustable fan speed. These features allow for more efficient heat dissipation as well as improved system stability in extreme conditions. By monitoring the temperature of the device, the ATS-15B-10-C1-R0 can adjust fan speed accordingly to maintain optimal efficiency.

In addition to advanced thermal energy management, the ATS-15B-10-C1-R0 also features an anodized aluminum electrolytic coating which helps protect it from oxidation. The anodic coating also helps ensure a more reliable and durable heat sink, making it well-suited for long-term use in products requiring high reliability. In addition to these features, the ATS-15B-10-C1-R0 also offers customization options such as different sizes and LED mounting options.

Conclusion

The ATS-15B-10-C1-R0 is an efficient and cost-effective heat sink designed for use in a variety of applications. Its low profile and lightweight construction make it suitable for use in tight spaces, while its integrated fins and anodized aluminum electrolytic coating provide improved thermal performance and durability. With its advanced thermal energy management features, it can ensure optimal efficiency and system stability even in extreme conditions. The ATS-15B-10-C1-R0 is an ideal solution for applications demanding space efficiency and low-cost manufacturing processes.

The specific data is subject to PDF, and the above content is for reference

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