| Allicdata Part #: | ATS-15B-120-C1-R0-ND |
| Manufacturer Part#: |
ATS-15B-120-C1-R0 |
| Price: | $ 3.34 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15B-120-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.03723 |
| 30 +: | $ 2.95491 |
| 50 +: | $ 2.79077 |
| 100 +: | $ 2.62666 |
| 250 +: | $ 2.46249 |
| 500 +: | $ 2.38041 |
| 1000 +: | $ 2.13415 |
Specifications
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Description
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Thermal - Heat Sinks covers a wide variety of components and applications, such as radiators, cooling fans, and air and liquid coolers. Heat sinks are specifically designed to dissipate the heat generated by electronic devices, such as processors, power supplies, and ASICs. One such product is the ATS-15B-120-C1-R0 Heat Sink. This article will discuss the application field and working principle of this heat sink.
Application Field of ATS-15B-120-C1-R0 Heat Sink: The ATS-15B-120-C1-R0 Heat Sink is designed to dissipate the heat generated by power supplies in high-power applications, such as server, UPS, and rack-mounted power supplies. The advanced design of this heat sink ensures a high level of thermal performance in a small form factor and allows for improved airflow over standard heat sinks. Additionally, its C2R (conductive to resistive) interface technology facilitates effective heat dissipation from the power supply to the heat sink.
Working Principle of ATS-15B-120-C1-R0 Heat Sink: The ATS-15B-120-C1-R0 Heat Sink utilizes a combination of conduction and convection to transfer heat away from the power supply. The conductive portion consists of heat fins which are thermally connected to the resistive portion which consists of a conductive material such as aluminum or copper. The thermally conductive material is bonded to the heat fins and acts as a bridge between the hot components and the heat sink. This bridge facilitates the conduction of heat from the component to the heat sink.The convection portion of the design is what helps to dissipate the heat away from the heat sink. The fans and the air flow in and out of the heat sink allows for improved cooling performance. The airflow also helps to dissipate heat from the surrounding components and the fan directs hot air away from the power supply.
Overall, the ATS-15B-120-C1-R0 Heat Sink is designed to provide efficient thermal performance for high-power applications. Its combination of conduction and convection makes it an effective heat dissipating solution. The C2R interface technology further facilitates transfer of heat from the component to the heat sink. By utilizing its advanced design, this heat sink is able to provide improved airflow and thermal performance in a small form factor that is ideal for high-power applications such as servers, UPS, and rack-mounted power supplies.
The specific data is subject to PDF, and the above content is for reference
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