| Allicdata Part #: | ATS25052-ND |
| Manufacturer Part#: |
ATS-15B-125-C2-R0 |
| Price: | $ 4.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15B-125-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.84930 |
| 10 +: | $ 3.74787 |
| 25 +: | $ 3.53934 |
| 50 +: | $ 3.33119 |
| 100 +: | $ 3.12304 |
| 250 +: | $ 2.91483 |
| 500 +: | $ 2.70663 |
| 1000 +: | $ 2.65458 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.92°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are a necessity in today’s world of electronic and electrical equipment. As these devices become increasingly complex, their need for heat dissipation and adequate cooling is greater. Heat sinks are a popular type of thermal management solution that can help dissipate large amounts of thermal energy from components or devices. The ATS-15B-125-C2-R0 is a heat sink with an innovative design that is highly effective at dissipating heat from electronic components.
The ATS-15B-125-C2-R0 is a stacked fin aluminum heat sink which features a base plate and multiple flat fins. The design of the fins is optimized to allow for maximum thermal transfer and improved cooling performance. The base plate has a double bonded copper layer to further enhance the heat transfer capabilities of the overall design. This heat sink is compatible with various types of mounting systems and is able to dissipate heat efficiently in compact spaces.
The application field of the ATS-15B-125-C2-R0 heat sink is primarily designed for use in electronic components such as resistors, transistors, and diodes. It is also widely used in high-power LEDs, power amplifiers, and other power-related components. The versatile design of the ATS-15B-125-C2-R0 makes it ideal for use in consumer electronics, automotive systems, industrial equipment, and many other applications.
The working principle of the ATS-15B-125-C2-R0 is simple. Heat from an electronic component is transferred to the fins of the heat sink. The fins then dissipate the heat by convection to the surrounding air. The double bonded copper layer at the base plate enhances the thermal transfer efficiency by bringing the fins closer to the source of the heat. The combination of the fin design and copper layers ensures that the heat transfer is maximized and the temperature of the electronic component is kept within safe operating parameters.
The ATS-15B-125-C2-R0 has proven itself to be an efficient and reliable heat sink solution. Its unique design features allow it to dissipate heat quickly while still maintaining a compact size. It is versatile enough to be used in a variety of applications and can be easily mounted using a variety of different mounting systems. This heat sink is the ideal choice for cooling electronic components ranging from power amplifiers to resistors. Due to its high-performance capabilities, the ATS-15B-125-C2-R0 is an excellent thermal management solution for any electronic component that needs to keep its operating temperature within safe levels.
The specific data is subject to PDF, and the above content is for reference