
Allicdata Part #: | ATS-15B-16-C3-R0-ND |
Manufacturer Part#: |
ATS-15B-16-C3-R0 |
Price: | $ 4.07 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 54X54X10MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.69936 |
30 +: | $ 3.49398 |
50 +: | $ 3.28835 |
100 +: | $ 3.08291 |
250 +: | $ 2.87736 |
500 +: | $ 2.67183 |
1000 +: | $ 2.62044 |
Specifications
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.126" (54.01mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 18.14°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ATS-15B-16-C3-R0 Thermal - Heat Sinks Application Field & Working Principle
Thermal - heat sinks are essential components used to transfer heat away from other components or objects. Heat sinks are present in electrical, electronic, and mechanical components that require efficient thermal management. In this article we will discuss the application field and working principle of the ATS-15B-16-C3-R0 Thermal - Heat Sink.The ATS-15B-16-C3-R0 is a thermal - heat sink with a large size that designed primarily increase surface area to effectively dissipate heat away from other components or objects. This heat sink features the extended design and asymmetric fin spacing which allow the thermal performance to reach an optimal level without compromising the airflow, allowing it to work in systems or applications that require higher temperature specification. The ATS-15B-16-C3-R0 also incorporates a Pde optimized design and a base plate mounted copper core which provides a higher thermal efficiency.The ATS-15B-16-C3-R0 is most commonly used in a wide range of applications, such as servers, central power systems, routers, industrial machines, amplifiers, LED, Large-scale IC chips, and other related objects. In addition, this heat sink can also be used for cooling objects in the automotive or defense industries. As it has a large parameter size of 96.9x96.9x106mm, ATS-15B-16-C3-R0 can also be used for large applications or machines that are subjected to regular and high heat output.When it comes to the working principle of the ATS-15B-16-C3-R0 heat sink, the heat generated from the device is transferred to the fins through the thin layer of thermal Grease, which is placed between the device and the fin surface. Afterward, the ambient air around the heat sink helps in dissipating the heat absorbed by the fins into the environment. This process helps in keeping the device or object cool.In addition, the design of the ATS-15B-16-C3-R0 makes it compatible to work with the majority of die-cast aluminum-based passive cooling components, allowing for greater flexibility in the system. This will provide better product protection and extend the lifespan of the component. As the ATS-15B-16-C3-R0 ultimately enhances the performance and thermal efficiency of system components, it is often used in extreme conditions where the highest level of reliability is desired.Overall, the ATS-15B-16-C3-R0 thermal - heat sink is a must-have passive cooling component if you are looking for efficient thermal management for a wide range of applications. Its large size, extended design, and asymmetric fin spacing make it the perfect choice for systems that require high temperature specification and thermal performance. Moreover, its compatibility with most die-cast aluminum-based passive cooling components is also beneficial for application which requires a greater flexibility.The specific data is subject to PDF, and the above content is for reference
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