| Allicdata Part #: | ATS-15B-172-C1-R0-ND |
| Manufacturer Part#: |
ATS-15B-172-C1-R0 |
| Price: | $ 3.49 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15B-172-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.16638 |
| 30 +: | $ 3.08091 |
| 50 +: | $ 2.90984 |
| 100 +: | $ 2.73861 |
| 250 +: | $ 2.56747 |
| 500 +: | $ 2.48188 |
| 1000 +: | $ 2.22514 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.71°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management technologies provide processes and products that can regulate thermal energy to avoid overheating caused by the large amount of energy generated in an electronic system; thus, protecting it from potential damage or costly repairs. Heat sinks are one of the methods used in thermal management. ATS-15B-172-C1-R0 is one type of a heat sink. In this article, we discuss the application field and working principle of ATS-15B-172-C1-R0.
The ATS-15B-172-C1-R0 is a lightweight thermal solution for mid-range cooling applications. It is suitable for direct mount and side-mount configurations. This heat sink is well-suited for applications where limited space and weight are concerns. This heat sink has a thermal performance of an impressive 7.3 W/°C, making it a viable choice for applications such as high-end graphics cards, solid-state relays, motor controlled inverters, as well as power systems and general electronic and power semiconductor applications.
The ATS-15B-172-C1-R0 features a P2 profile with a unique dimpled design that improves heat dissipation. This heat sink also features a slat design design to effectively reduce thermal resistance and improve convective heat transfer. This allows air to flow smoothly across the entire surface of the heat sink to better dissipate heat, while also preventing hot spots from developing during operation. In addition, the ATS-15B-172-C1-R0 is constructed of woven aluminum fins to provide more stability and better performance.
In terms of its working principle, the ATS-15B-172-C1-R0 heat sink is designed to absorb excess thermal energy created by an electronic circuit and dissipate it harmlessly into the environment. It is designed to be mounted on the top of the circuit boards so that it can effectively dissipate the heat produced by the components on the board. This heat is then dissipated into the environment using the heat sink\'s fins, meaning it will not accumulate in a single area causing operational issues.
The ATS-15B-172-C1-R0 is a great choice for thermal management applications where limited space and weight are a concern. Its unique dimpled and slat design work together to improve heat dissipation and reduce thermal resistance. It is suitable for high-end graphics cards, solid-state relays, motor controlled inverters as well as power systems and general electronic and power semiconductor applications. With its lightweight construction and efficient thermal performance, the ATS-15B-172-C1-R0 is an excellent choice for thermal management applications.
The specific data is subject to PDF, and the above content is for reference