ATS-15B-21-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.362" (60.00mm)
Width:	2.362" (60.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	16.26°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-15B-21-C1-R0 is an advanced thermal heat sink designed to function as an alternative cooling solution to traditional air-cooled systems. This heat sink is made up of a number of components which make up the thermal module; a heat spreader which disperses heat generated by the electronic components, and a heat sink which dissipates the heat. The heat sink also contains a finned surface which increases the surface area of the heat sink, allowing for greater dissipation of heat.

Application Field

The ATS-15B-21-C1-R0 heat sink can be used in a number of applications, ranging from high-end computer gaming to telecommunications and power equipment. The heat sink is capable of effectively dissipating heat generated from high-powered processors, allowing them to run at optimum speeds with decreased risk of overheating. The ATS-15B-21-C1-R0 also has the ability to reduce overall system temperatures due to its higher thermal dissipation rate.The ATS-15B-21-C1-R0 is also suitable for high power electronics such as microwave ovens and amplifiers. The heat sink is able to efficiently disperse the heat from these components, which can otherwise cause serious damage if not properly cooled.

Working Principle

The working principle behind the ATS-15B-21-C1-R0 is fairly simple. The heat generated by the electronic components is spread evenly throughout the unit by the heat spreader. This heat is then dissipated through the heat sink by the finned surface, which increases the surface area of the heat sink. As the heat is dissipated, it is then relayed through the air by natural convection.The ATS-15B-21-C1-R0 is also equipped with a built-in fan which further aids in dissipating the heat. The fan speeds up the process of heat dissipation by creating an air flow over the heat sink, which helps to further disperse the heat.

Conclusion

The ATS-15B-21-C1-R0 is an advanced thermal heat sink designed to provide an effective cooling solution to a variety of electronic components. It is most suitable for high power electronics such as processors and microwaves, which are at risk of overheating if not properly cooled. The heat sink is capable of dissipating the heat through its finned surface and built-in fan, and it is able to operate at higher temperatures than traditional air-cooled systems.

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