| Allicdata Part #: | ATS-15B-24-C3-R0-ND |
| Manufacturer Part#: |
ATS-15B-24-C3-R0 |
| Price: | $ 5.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15B-24-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.81068 |
| 30 +: | $ 4.54314 |
| 50 +: | $ 4.27594 |
| 100 +: | $ 4.00869 |
| 250 +: | $ 3.74144 |
| 500 +: | $ 3.47420 |
| 1000 +: | $ 3.40738 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.43°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks encompass a wide range of products that aim to reduce the temperature of a particular component or system by dissipating and radiating heat. An important advancement in the technology is the ATS-15B-24-C3-R0, which has become a popular choice for many applications.
The ATS-15B-24-C3-R0 thermal - heat sink is a type of extruded heat sink which has a cast aluminum body. It has excellent thermal performance, hence why it is becoming increasingly popular for many applications. It is designed to dissipate and radiate heat away from a component or system, thus preventing it from overheating and improving its performance. The ATS-15B-24-C3-R0 has an effective thermal resistance of 0.2 °C/W and is capable of dissipating up to 10 W of heat, providing superior thermal management and cooling performance. The aluminium fin structure is designed to maximize dissipation and radiation of heat and has a surface area of 8.7 cm².
The ATS-15B-24-C3-R0 has a number of beneficial features that make it suitable for various applications. It has a durable, lightweight construction and is more cost-effective than other types of thermal - heat sink products. It is also easy to install, making it an attractive option for many users. In addition, the ATS-15B-24-C3-R0 features an optimised design that ensures efficient heat dissipation and radiation, as well as long-term reliability.
This thermal - heat sink is ideal for a wide range of electronic, electrical and mechanical applications. It can be used in industrial, automotive and consumer electronics systems and is suitable for cooling CPUs, power MOSFETs, LEDs, power transistors, integrated circuits, power supplies, converters, voltage regulators, regulated DC-DC converters and motor drivers. It is also suitable for cooling printed circuit boards used in portable and handheld devices such as smartphones and tablets, as well as other devices that generate high levels of heat and require efficient thermal management.
The ATS-15B-24-C3-R0 is designed to work with forced and convection air cooling, thus helping to improve the efficiency of both cooling systems. When working with forced air cooling, the aluminium fins on the ATS-15B-24-C3-R0 heat sink act as an efficient heatsink for dissipating heat out of the system. This helps to reduce the load on the fan, thus allowing it to operate more efficiently. When working with convection air cooling, the ATS-15B-24-C3-R0 acts as a radiator, radiating heat away from the device or component to the surrounding environment.
The ATS-15B-24-C3-R0 is a versatile and efficient thermal - heat sink that has a wide variety of applications and features that make it an attractive option for many users. Its lightweight and cost-effective design combined with its optimised design make it an ideal choice for many applications. Moreover, its ability to work with both forced and convection air cooling helps to improve the efficiency of both cooling systems.
The specific data is subject to PDF, and the above content is for reference