| Allicdata Part #: | ATS25152-ND |
| Manufacturer Part#: |
ATS-15B-27-C2-R0 |
| Price: | $ 7.71 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15B-27-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.94260 |
| 10 +: | $ 6.75486 |
| 25 +: | $ 6.37963 |
| 50 +: | $ 6.00440 |
| 100 +: | $ 5.62918 |
| 250 +: | $ 5.25390 |
| 500 +: | $ 4.87862 |
| 1000 +: | $ 4.78480 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are devices that are used to absorb, dissipate and manage heat in order to protect an electronic component from overheating. The ATS-15B-27-C2-R0 is a thermal heat sink that is designed to provide superior heat transfer and durable long life performance. It is a high-quality and cost-effective solution for a wide variety of applications, including computers, consumer electronics, telecommunications, and other high-reliability applications.
The ATS-15B-27-C2-R0 is a compact aluminum heat sink, measuring 1.25 inches in height, 3.35 inches in width, and 2.75 inches in depth. It has a rated power dissipation of 15W, and is capable of dissipating thermal energy up to 27 W. Additionally, it has an R0 thermal resistance in the range of 1.2˚C/W which provides superior heat transfer.
In order to function properly, the ATS-15B-27-C2-R0 utilizes convection cooling. This method of cooling works by transferring the heat generated by an electronic component into the air. This is achieved by using an aluminum heat sink with a large surface area that allows heat to be transferred very rapidly and efficiently. Additionally, the aluminum fins on the top of the heat sink help to increase the surface area by providing additional contact points for convection cooling.
The design of the ATS-15B-27-C2-R0 also features a number of other features that allow it to provide superior thermal performance. The fins are arranged in such a way that they provide maximum airflow for efficient cooling. Additionally, the fins are anodized to reduce surface resistance and improve heat transfer. Moreover, the base incorporates thermal epoxy adhesive to improve thermal conductivity and provide a secure grip to the components.
As a result of these features, the ATS-15B-27-C2-R0 can be used in a wide variety of applications and is suitable for a wide range of environments. It can be used for applications such as computers, radio frequency (RF) components, consumer electronics, automotive systems, and high-reliability applications. Additionally, it is suitable for use in both indoor and outdoor environments. This makes it an ideal solution for applications where long term reliability and performance are required.
In conclusion, the ATS-15B-27-C2-R0 is a thermal heat sink that is designed to provide superior heat transfer and long life performance. It utilizes convection cooling which allows for efficient dissipation of heat generated by components and helps to protect them from overheating. Additionally, the anodized fins and thermal epoxy adhesive provide a secure grip and high thermal conductivity. All of these features make it a cost-effective solution for a wide range of applications, both indoors and outdoors.
The specific data is subject to PDF, and the above content is for reference