ATS-15B-42-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.280" (57.90mm)
Width:	2.400" (60.96mm)
Diameter:	--
Height Off Base (Height of Fin):	0.900" (22.86mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.30°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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.Introduction of ATS-15B-42-C1-R0
ATS-15B-42-C1-R0 is a type of thermal-heat sink, which is designed for the cooling needs of high power electronics and other devices to ensure their safe and stable operation. It is made of aluminum material and has an anodized finish which gives it a black nickel look and is highly resistant to corrosion. It also has a high thermal conductivity and is highly efficient in extracting heat from high power electronics.Application Field
The ATS-15B-42-C1-R0 thermal-heat sink is suitable for applications related to high power electronics and other devices. It is especially suitable for cooling processors, graphics cards, adaptors, power converters, DC/DC converters, voltage regulators, and other devices that generate large amounts of heat or require stable operation. Furthermore, it is also suitable for applications involving storage devices, such as disks and SSDs, as well as server, computer, router, and network devices.Working Principle
The working principle of ATS-15B-42-C1-R0 thermal-heat sink is based on the concept of thermodynamics. It utilizes the conduction of heat from the source to its own body and then to the surrounding environment. The aluminum material used in the thermal-heat sink has a high thermal conductivity, which helps it to efficiently extract heat from the source and dissipate it to the surroundings. Furthermore, the performance of the thermal-heat sink is also enhanced by its highly efficient airflow fins, which optimize the heat transfer from the source device to its surface.Advantages
The ATS-15B-42-C1-R0 thermal-heat sink offers several advantages over traditional cooling methods. Firstly, it is highly efficient in dissipating heat from the source by simply utilizing the conduction of heat from the source to its own body and then to the surroundings. Additionally, due to its highly efficient airflow fins, it is able to maximize the heat transfer from the source device to its surface. Furthermore, its aluminum material and anodized finish offers a high level of corrosion resistance, making it a dependable cooling solution for high power electronics and other devices.Conclusion
Overall, the ATS-15B-42-C1-R0 thermal-heat sink is an efficient cooling solution for high power electronics and other devices. It is capable of efficiently dissipating heat from the source by utilizing the conduction of heat from the source to its own body and then to the surroundings. In addition, its aluminum material and anodized finish offers a high level of corrosion resistance, making it a dependable cooling solution. Finally, its highly efficient airflow fins ensures optimal heat transfer from the source device to its surface.

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