| Allicdata Part #: | ATS-15B-73-C1-R0-ND |
| Manufacturer Part#: |
ATS-15B-73-C1-R0 |
| Price: | $ 3.10 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15B-73-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78964 |
| 30 +: | $ 2.71446 |
| 50 +: | $ 2.56360 |
| 100 +: | $ 2.41284 |
| 250 +: | $ 2.26205 |
| 500 +: | $ 2.18664 |
| 1000 +: | $ 1.96044 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are components that transfer and dissipate heat away from sensitive electronic components and devices. The heat sink helps by providing a much larger surface area for heat to dissipate into the environment. Heat sinks are a vital piece of many types of electronic devices and are used in a wide range of applications, from power electronics to telecommunications.
ATS-15B-73-C1-R0 Application Field and Working Principle
The ATS-15B-73-C1-R0 is a heat sink designed to provide an effective cooling system solution in applications where space is limited. It is commonly used for cooling processors, power supplies, and other high power components in electronic devices. The heat sink is designed with a combination of metal and plastic materials, allowing for greater versatility and efficiency in thermal performance.
The heat sink is composed of aluminium, which is an excellent heat conductor, with a high thermal conductivity rating of 200-400 W/(mK). The aluminium body is milled with specific channels which increase the surface area and allow for efficient heat dissipation. The fins are pour-moulded with multiple channels, prolonging heat dissipation, and enhancing air circulation. In addition, the heat sink also features a built-in fan that helps to dissipate heat away from the active components.
The design of the ATS-15B-73-C1-R0 makes it ideal for cooling processors, power supplies, and other high power components in electronic devices that are used in a limited space. Its high efficiency in thermal performance enables it to effectively transfer heat away from high powered components to prevent them from overheating and damaging the system. In addition, the heat sink is designed with a strong construction and high-quality material that ensures reliable performance and long-term service. This makes it an excellent choice in heat sink solutions for a variety of applications.
The ATS-15B-73-C1-R0 is a great choice for cooling electronic components in applications where space is limited. It offers high performance and reliable operation for an extended period of time. The design of the metal and plastic construction ensures effective heat dissipation, making it an ideal solution for cooling high powered components to prevent overheating and downtime.
The specific data is subject to PDF, and the above content is for reference