ATS-15B-83-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-15B-83-C3-R0-ND

Manufacturer Part#:

ATS-15B-83-C3-R0

Price: $ 3.96
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X30MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-15B-83-C3-R0 datasheetATS-15B-83-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.59667
30 +: $ 3.39654
50 +: $ 3.19675
100 +: $ 2.99697
250 +: $ 2.79717
500 +: $ 2.59738
1000 +: $ 2.54743
Stock 1000Can Ship Immediately
$ 3.96
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.76°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a critical part of electronic system design. Heat generated from active components must be removed in order to maintain system health and reliability. Heat sinks are a key part of a thermal management strategy – and are utilized to dissipate heat generated from components such as integrated circuits, power supplies, microprocessors, and other electronic components. The ATS-15B-83-C3-R0 Heat Sink is a highly efficient heat sink designed specifically to cope with the high levels of heat generated in today\'s market.The ATS-15B-83-C3-R0 Heat Sink is constructed with densely-packed fins and an intelligently designed fin geometry. This design allows for increased surface area that dissipates maximum heat, ensuring the components suffer minimal thermal damage. The design also takes into account natural airflow dynamics, allowing the ATS-15B-83-C3-R0 Heat Sink to use ambient air more efficiently in heat dissipation.The ATS-15B-83-C3-R0 Heat Sink is constructed from aluminum and has a natural silver finish to complement its appearance and service requirements. It is designed to provide excellent heat dissipation and requires no large footprints or other surface modifications. The fins are made from tightly-packed extruded aluminum, allowing for maximum surface area for heat dissipation in a small package.The construction and design of the ATS-15B-83-C3-R0 Heat Sink allow for greater heat transfer capabilities, creating an optimal thermal environment. This translates to longer life for the components and better reliability overall. The heat sink\'s construction also eliminates the need for additional frame or substrate modifications, saving time and money in the setup process.The ATS-15B-83-C3-R0 Heat Sink is designed to offer efficient heat dissipation over a wide range of applications. It can be used in computer cases, power supplies, power converters, machine control systems, and other applications requiring reliable and efficient thermal management solutions. The heat sink is extremely lightweight and costs much less than more traditional designs found in high-end systems.The ATS-15B-83-C3-R0 Heat Sink is also extremely durable and has excellent physical integrity. Its tight fin structure and aluminum construction allow for a long-lasting product and dependable service. The heat sink also offers tighter tolerances for accurate bonding and attachment even in high-vibration environments. The heat sink\'s design also ensures superior thermal performance.The ATS-15B-83-C3-R0 Heat Sink is an excellent choice for situations where superior heat dissipation is needed in a compact package. Its advanced construction and design allow for maximum cooling and efficiency, making it ideal for a wide range of applications. With its low cost and high performance, the ATS-15B-83-C3-R0 Heat Sink is an excellent choice for anyone looking for a reliable and efficient thermal management solution.

The specific data is subject to PDF, and the above content is for reference

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