ATS-15C-04-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	11.55°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Heat sinks are devices designed to dissipate heat generated by electronic components.The purpose of using a heat sink in a thermal application is to provide a thermal interface between the component and the ambient air, providing cooling to prolong component life and improve the performance of the component. The ATS-15C-04-C1-R0 is a heat sink which is used in a variety of thermal applications in consumer, commercial and industrial environments.

ATS-15C-04-C1-R0 Application

The ATS-15C-04-C1-R0 is a cost-effective heat sink solution for cooling integrated circuits (ICs) used in automotive, telecommunications, medical, and HVAC industries. It is designed to dissipate a maximum of 15 watts of power from the ICs and maximize its performance. This heat sink is composed of aluminum and comes in a SMT (Surface Mount Technology) package for added flexibility and easy installation. With a thermal resistance of 0.062°C/W and a total power dissipation of 9W, this heat sink solution is suitable for a variety of applications.

ATS-15C-04-C1-R0 Working Principle

A heat sink works by absorbing heat from the ICs and spreading the heat over a larger area, allowing the heat to dissipate into the ambient air faster than it would if left to its own devices. The ATS-15C-04-C1-R0 heat sink utilizes this principle to reduce the amount of heat generated by the IC, prolonging its life and improving its performance. The ATS-15C-04-C1-R0 heat sink is composed of a copper base and an aluminum shroud. The copper base provides good thermal conductivity, enabling heat to be conducted away from the IC quickly. The aluminum shroud provides structural integrity and better heat radiation capabilities which helps to efficiently dissipate heat into the environment. In addition, the ATS-15C-04-C1-R0 heat sink also utilizes the principle of convection to reduce the heat generated by the IC. A fan is mounted above the heat sink which helps to move warm air away from the device and dissipate it away from the device quickly. This creates a convection cycle; as the warm air is moved away from the device, cooler air is drawn in and is circulated around the IC, reducing its temperature.

Conclusion

The ATS-15C-04-C1-R0 heat sink is an ideal solution for a wide range of thermal applications and is suitable for a variety of industries. Utilizing the principles of thermal conductivity, convection and radiation, this heat sink is able to effectively dissipate heat from the integrated circuits and reduce their temperature. As a result, this heat sink ensures prolonged life and improved performance of the ICs.

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