| Allicdata Part #: | ATS-15C-100-C3-R0-ND |
| Manufacturer Part#: |
ATS-15C-100-C3-R0 |
| Price: | $ 4.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15C-100-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.22163 |
| 30 +: | $ 3.98727 |
| 50 +: | $ 3.75278 |
| 100 +: | $ 3.51823 |
| 250 +: | $ 3.28369 |
| 500 +: | $ 3.04914 |
| 1000 +: | $ 2.99050 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are an essential component for any device that needs to operate within specified temperature ranges. The primary role of heat sinks is to remove heat from critical components such as processors, graphics cards and memory chips to ensure that the device runs safely and at optimal temperatures. The ATS-15C-100-C3-R0 heat sink is a specific type of heat sink designed with specific properties that make it suitable for a variety of applications.
The ATS-15C-100-C3-R0 heat sink is an aluminum pin-fin heat sink featuring pin-fin technology combined with advanced thermal properties. This ensures excellent thermal performance with a low profile design that makes it suitable for use in a variety of applications. It features thermally optimized multiple pin designs, high surface area, and an optimized air gap structure for excellent heat dissipation. In addition, the heat sink is designed with a black anodized finish for maximum durability.
The ATS-15C-100-C3-R0 heat sink is ideal for PCB and LED cooling, chiller, data server and telecom applications. It can also be used for industrial cooling due to its high thermal performance and low profile design. In LED applications, the thermal performance of the heat sink allows for improved light output, longer life and reduced running costs. It is also suitable for other high temperature applications.
The working principle of the ATS-15C-100-C3-R0 heat sink is the conduction and convection of heat. Heat is first conducted away from critical components and then radiated through the heat sink into the environment. The air gap structure of the heat sink ensures maximum dissipation of the heat, thus ensuring better cooling performance. The thermally optimized multiple pins also improve the thermal performance of the heat sink, as they are designed to ensure even air flow around the heat sink.
In conclusion, the ATS-15C-100-C3-R0 heat sink is a versatile and reliable thermal solution that offers excellent thermal performance and a low-profile design. Its features make it suitable for a variety of applications, such as PCB and LED cooling, chiller, data server and telecom applications. Its working principle is based on the conduction and convection of heat, making it ideal for high temperature applications. The thermally optimized multiple pin design and air gap structure ensures maximum heat dissipation, making it an effective cooling solution.
The specific data is subject to PDF, and the above content is for reference