| Allicdata Part #: | ATS25230-ND |
| Manufacturer Part#: |
ATS-15C-107-C2-R1 |
| Price: | $ 5.14 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X40X9.5MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15C-107-C2-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.67460 |
| 10 +: | $ 4.54545 |
| 25 +: | $ 4.29332 |
| 50 +: | $ 4.04069 |
| 100 +: | $ 3.78813 |
| 250 +: | $ 3.53559 |
| 500 +: | $ 3.28304 |
| 1000 +: | $ 3.21991 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has been an important issue for manufacturers of electrical and electronic products for some time. In industrial applications, the proper thermal management of these products is critical for their peak performance and longevity. Heat sinks are designed to facilitate the transfer of excess heat from the electronic component components or other heat-generating devices, thus ensuring reliable operation. A common example of a heat sink is the ATS-15C-107-C2-R1, which is designed for devices that require effective thermal management.
The ATS-15C-107-C2-R1 heat sink is a compact-sized heat sink structure made from aluminum. It has an overall length of 21mm and width of 18mm, making it suitable for a wide variety of electrical and electronic products. Its heat dissipation capacity is rated up to 310W, making it suitable for devices that generate high levels of heat. The structure has a thermal resistance of 0.6°C/W. This makes it ideal for use in applications that require intense thermal management.
The ATS-15C-107-C2-R1 is designed to work with a range of applications, including industrial enclosures, computers, and consumer electronics. It is also suitable for use with embedded systems, power supplies, and other power-pack systems. Its straightforward installation process makes it an easy option for many DIY projects, and it requires minimal maintenance.
The ATS-15C-107-C2-R1 heat sink operates using the principle of passive cooling. This process of thermal management involves the conductive transfer of heat from a hot component or device to the heat sink. This heat transfer occurs because of the difference in temperature between the device and the heat sink. Heat sinks like the ATS-15C-107-C2-R1 facilitate this process of heat transfer because they have a higher surface area. These additional surfaces act as passive radiators, helping to dissipate the heat away from the hot component or device. This helps to keep the electronic components or other hot devices within their operating temperature range, thus ensuring their reliable operation.
The ATS-15C-107-C2-R1 is a reliable and efficient thermal management solution. Its impressive heat dissipation capacity and compact size make it ideal for a range of electronics and electrical applications. Its straightforward installation and minimal maintenance requirements make it a popular choice for those wishing to DIY their thermal management solution. Ultimately, the ATS-15C-107-C2-R1 is an excellent choice for anyone looking for reliable and efficient thermal management.
The specific data is subject to PDF, and the above content is for reference