ATS-15C-117-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.46°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

A thermal heat sink, also commonly known as a cold plate, is a device used to dissipate heat from an electronic or mechanical device to the surrounding environment. Heat sinks were developed to allow heat produced by electronic components to be moved away from them and thus preventing their temperatures from rising to unsafe levels. The ATS-15C-117-C1-R0 is a type of thermal heat sink designed for cooling both electrical and electronic components.

Application Field

The ATS-15C-117-C1-R0 thermal heat sink is a high performance and cost effective solution for cooling a wide variety of applications. These types of heat sinks are able to effectively cool both digital and analog components, including microprocessors, microcontrollers, ASICs, FPGAs, and a variety of other integrated circuits. Due to its compact size, the ATS-15C-117-C1-R0 can also be used in small form factor products such as satellites and unmanned aerial vehicles (UAVs).

Design Features

The ATS-15C-117-C1-R0 is designed to provide a higher level of cooling efficiency than other types of thermal heat sinks. It has a low particular resistance that is comparable to a Liquid Crystal Polymer (LCP) cold plate. It also features a passive heat sink design that utilizes aluminum alloy and copper composite construction. This design makes the ATS-15C-117-C1-R0 lightweight yet highly efficient. Additionally, due to its unique design, the ATS-15C-117-C1-R0 is able to provide a degree of thermal insulation that is superior to other air-cooled heat sinks.

Working Principle

The ATS-15C-117-C1-R0 employs a passive cooling mechanism to dissipate heat quickly and efficiently. The device is comprised of a copper heat sink and a series of aluminum alloy fins. The heat generated by the electronic components is conducted through the copper, then transferred to the aluminum fins by conduction where it is dissipated to the external environment through convection. This ensures that the temperature inside of the device is kept at a safe level.

Conclusion

The ATS-15C-117-C1-R0 is a high performance and cost-effective thermal heat sink designed for cooling both electrical and electronic components. Its lightweight yet highly efficient design allows for superior thermal insulation which ensures that the internal temperature of the device remains at a safe level. Additionally, its passive cooling mechanism dissipates heat quickly and efficiently, making it an ideal solution for a variety of applications.

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