ATS-15C-179-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-15C-179-C1-R0-ND

Manufacturer Part#:

ATS-15C-179-C1-R0

Price: $ 3.70
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X30MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-15C-179-C1-R0 datasheetATS-15C-179-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.36420
30 +: $ 3.27348
50 +: $ 3.09154
100 +: $ 2.90972
250 +: $ 2.72785
500 +: $ 2.63691
1000 +: $ 2.36412
Stock 1000Can Ship Immediately
$ 3.7
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.90°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an important consideration in any modern electronics application, and a key element of this is the heat sink. Heat sinks are used to dissipate heat away from sensitive components in order to protect them against damage from excessive temperatures. ATS-15C-179-C1-R0 is a popular heat sink, and this article will discuss the application field and working principle of this high-performance device.

Application Field

The ATS-15C-179-C1-R0 heat sink is a general-purpose heat-dissipation device that can be used in a variety of applications, ranging from power supplies to consumer electronics. The device features a 1U profile, which makes it suitable for applications where height is a concern, such as in tight enclosures. The device is also designed for efficient thermal management, with an optimized fin design that helps to maximize thermal dissipation.

Due to its high-performance capabilities, the ATS-15C-179-C1-R0 heat sink is an ideal choice for electronics applications that require reliable thermal management, such as computers, telecommunications equipment, and industrial automation systems. The device is also widely used in consumer electronics, owing to its reliable performance and compact form factor.

Working Principle

The ATS-15C-179-C1-R0 heat sink works by dissipating heat away from sensitive components, allowing these components to operate correctly and safely without suffering thermal damage. Heat is dissipated from the device via the fins, which are designed to optimally capture and spread out the heat from the source component. The fins then dissipate the heat to the surrounding air, allowing it to be safely dispersed.

Heat sinks work best when they are mounted to a heat-conductive surface, such as a metal heatsink plate. The plate helps to spread out the heat from the component and significantly increases the surface area of the heat sink, allowing it to dissipate heat more efficiently. The plate can also help to cool the heat sink more effectively, since it can absorb the heat and transfer it away from the component.

In addition to dissipating heat away from sensitive components, the ATS-15C-179-C1-R0 heat sink also helps to reduce noise levels. This is accomplished by creating an acoustic barrier between the heat source and the sensitive components, which helps to block out sound and vibration from the component. This makes the device an ideal choice for applications where noise reduction is important, such as in industrial automation systems.

Conclusion

ATS-15C-179-C1-R0 is a high-performance heat sink that can be used in a variety of electronics applications. The device is designed for efficient thermal management, with an optimized fin design that helps to maximize thermal dissipation. In addition, the device helps to reduce noise levels, making it an ideal choice for applications where noise reduction is important. The device is suitable for applications where height is a concern, such as in tight enclosures, and it is widely used in consumer electronics, due to its reliable performance and compact form factor.

The specific data is subject to PDF, and the above content is for reference

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