| Allicdata Part #: | ATS-15C-18-C3-R0-ND |
| Manufacturer Part#: |
ATS-15C-18-C3-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15C-18-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.89781 |
| 30 +: | $ 3.68151 |
| 50 +: | $ 3.46487 |
| 100 +: | $ 3.24834 |
| 250 +: | $ 3.03178 |
| 500 +: | $ 2.81523 |
| 1000 +: | $ 2.76109 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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.ATS-15C-18-C3-R0 Thermal - Heat Sinks
The ATS-15C-18-C3-R0 is a thermal - heat sinks device that is used to transfer heat away from one surface to a lower temperature surface. Heat sinks are commonly used in electronics and electrical circuits to keep components from becoming too hot due to electrical current flow. They do this by dissipating, radiating, or convecting the heat away from the component or circuit board.
The ATS-15C-18-C3-R0 heat sink is a extruded aluminum unit, consisting of a 15 mm thick aluminum extrusion with punched fins and a flat top. The top and bottom surfaces are covered with a painted epoxy resin for protection against corrosion. This device is designed to provide good thermal performance in a relatively compact size and it can be installed in tight spaces.
The heat sink has a thermal resistance of 0.0032 Kelvin per Watt and a power dissipation of 18 Watts. This makes it an ideal choice for applications which require efficient thermal management, such as LED lighting, power converters, computers, and other electronics.
The heat transfer mechanism of the ATS-15C-18-C3-R0 is mainly convection-based. This heat sink has air-fins that are designed to create a convection flow of air that helps to dissipate the heat away from the component or circuit board, through the fins, and into the surrounding environment. This process is made more effective due to the largest fin volume and sheet thickness.
The heat sink also features patented push-pin fasteners for faster installation and durability. The device offers further flexibility through its stable mounting location and multiple screw holes. The design of the hole layout minimizes the need for specialty screws, saving the user both time and money.
In addition to its thermal performance, the ATS-15C-18-C3-R0 also offers other benefits. It is lightweight and robust, making it more suitable for high-mechanical loads. The material used is also corrosion-resistant, ensuring that the life span of the device is longer than traditional heat sinks.
The ATS-15C-18-C3-R0 can be used in a variety of applications, such as LED lighting, data storage, general electronics, and other high-current applications. This device is designed for use in high-ambient temperature environments where the efficient dissipation of heat is critical.
Overall, the ATS-15C-18-C3-R0 is a reliable and efficient thermal - heat sink for a variety of applications. With its high-performance and corrosion-resistant design, it is the ideal choice for anyone looking for a device that can provide effective thermal management in a relatively compact size.
The specific data is subject to PDF, and the above content is for reference