| Allicdata Part #: | ATS-15C-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-15C-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15C-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-15C-20-C1-R0 thermal-heat sink is a specialized piece of equipment designed to effectively dissipate excessive heat or thermal energy from their respective applications. The ATS-15C-20-C1-R0 thermal-heat sink is composed of a high thermal conductivity aluminum fin that is strategically placed between two strips of copper material. The combination of the aluminum fin and copper strips provides the ATS-15C-20-C1-R0 with an effective thermal capacity.
The main purpose of the ATS-15C-20-C1-R0 thermal-heat sink is to regulate the temperatures of its attached electronics and components by actively dissipating the rising thermal energy produced by overly-taxed electronic components. For example, in a computer system, the ATS-15C-20-C1-R0 will help in the dissipation of excessive heat generated by the components such as the CPU, GPU, and RAM.
In terms of function, the ATS-15C-20-C1-R0 thermal-heat sink is constructed in such a way that it allows for air movement between the fin and its copper strips. This airflow helps to draw away the thermal energy produced from the attached electronic components and create a cooling effect. Furthermore, the ATS-15C-20-C1-R0 also enables for heat to concentrate on certain components or electronics as needed by directing the air over specific areas.
Additionally, the ATS-15C-20-C1-R0 thermal-heat sink is designed with a low contact resistance of less than one ohm, meaning that it has a low contact-to-device capacitance which translates into a lower thermal impedance. This helps to enable the ATS-15C-20-C1-R0 to actively transfer heat from component to component with minimal effort. Furthermore, the ATS-15C-20-C1-R0 thermal-heat sink comes in several different sizes and shapes which allows it to be easily integrated into a variety of different applications.
The ATS-15C-20-C1-R0 thermal-heat sink is commonly used in applications such as power amplifiers, semiconductor electronics, and electronic test equipment. Additionally, the ATS-15C-20-C1-R0 thermal-heat sink can also be used in other applications, such as automotive, aerospace, and medical applications, to help control and regulate the temperatures of their respective components.
In conclusion, the ATS-15C-20-C1-R0 thermal-heat sink is an efficient and reliable piece of technology that is utilized in multiple industries and applications in order to help dissipate excessive thermal energy produced by their respective components. The ATS-15C-20-C1-R0 features a low thermal impedance, as well as a low contact resistance, which makes it the ideal choice for those who need a reliable and efficient thermal-heat sink.
The specific data is subject to PDF, and the above content is for reference