| Allicdata Part #: | ATS-15C-32-C3-R0-ND |
| Manufacturer Part#: |
ATS-15C-32-C3-R0 |
| Price: | $ 5.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15C-32-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.08914 |
| 30 +: | $ 4.80669 |
| 50 +: | $ 4.52390 |
| 100 +: | $ 4.24116 |
| 250 +: | $ 3.95842 |
| 500 +: | $ 3.67567 |
| 1000 +: | $ 3.60499 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.54°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are commonly used in the electronics industry to dissipate and manage heat produced from high-functioning electronics. The ATS-15C-32-C3-R0 is a specific type of thermal heat sink used for cooling various applications. This article will discuss the application fields and working principle of the ATS-15C-32-C3-R0.
The ATS-15C-32-C3-R0 is a powerful thermal heat sink, capable of dissipating heat up to 40W TDP. As such, it is extremely useful for cooling applications such as CPUs, GPUs, and other high-speed processors. Additionally, it can be used to effectively cool internal storage and RAM, allowing for better performance and increased reliability. Furthermore, this heat sink can be used to regulate the temperatures inside an electronics enclosure, ensuring the components do not overheat due to poor thermal management.
In terms of construction, the ATS-15C-32-C3-R0 features a combination of copper and aluminum alloys. Copper has excellent heat conducting properties, allowing the heat sink to quickly disperse heat away from the processor and other components. The aluminum alloy ensures that the sink has excellent strength and rigidity, allowing it to withstand the high temperatures of dissipated heat. Together, these two materials make the ATS-15C-32-C3-R0 an effective thermal heat sink.
The ATS-15C-32-C3-R0 works on the principle of thermodynamics. Heat from the processor is drawn away from the processor and dissipated outwards, reducing the processor\'s temperature in the process. This is accomplished by drawing away heat energy from the processor and spreading it throughout the heat sink. As the heat flows outward, it releases energy and dissipates, reducing the overall temperature of the processor.
Furthermore, the fan assembly also plays an important role in the heat sink\'s efficiency. The fan draws air into the sink, further dissipating the heat away from the processor. This airflow helps to maximize heat dissipation, ensuring that the processor remains cool and performs at its peak capacity. The fan also helps to reduce noise levels, making it an ideal choice for quieter cooling solutions.
Overall, the ATS-15C-32-C3-R0 thermal heat sink is an effective and reliable cooling solution for the electronics industry. Its combination of copper and aluminum alloys allows it to effectively dissipate heat from components, while the internal fan helps to reduce noise levels. Furthermore, it is an excellent choice for cooling CPUs, GPUs, and other high-speed processors, as well as regulating temperatures within an enclosed electronics environment. As such, the ATS-15C-32-C3-R0 is an important part of any thermally managed electronics system.
The specific data is subject to PDF, and the above content is for reference