| Allicdata Part #: | ATS-15C-50-C3-R0-ND |
| Manufacturer Part#: |
ATS-15C-50-C3-R0 |
| Price: | $ 3.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15C-50-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.22182 |
| 30 +: | $ 3.13467 |
| 50 +: | $ 2.96050 |
| 100 +: | $ 2.78630 |
| 250 +: | $ 2.61218 |
| 500 +: | $ 2.52510 |
| 1000 +: | $ 2.26388 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important consideration in the design of electronic products. One way to address thermal management needs is through the selection and application of a thermal heat sink. A wide variety of heat sinks are available for selection by designers, and the ATS-15C-50-C3-R0 is one particular option. This unit features a stacked fin design constructed from aluminum and is suitable for cooling electronic components in a variety of scenarios.
The ATS-15C-50-C3-R0 has a basic working principle of moving warm air away from an area where it can harm equipment, and allow cool air to enter, reducing the internal temperature of an electronic device. Heat is pulled from the target components by dissipation into the heat sink through fins. As warm air reaches the finned surface, a convection process begins where its temperature is lowered and it then rises into the ambient. The aluminum construction of the ATS-15C-50-C3-R0 makes it a suitable choice for many applications because it is both resilient from surface tension, vibration, and corrosive materials, and light-weight at the same time.
The ATS-15C-50-C3-R0 has a number of applications, most notably in the industrial and medical devices domains. It is also a popular choice for consumer electronics, including laptop, desktop, and tablet computers. Due to its design with a stacked fin structure, the ATS-15C-50-C3-R0 is well-suited for areas with limited space where a larger heat sink may not fit. While its small size makes it well-suited for mobile applications, the finned design ensures it is just as effective as larger, traditional sinks.
The ATS-15C-50-C3-R0 has a number of advantages compared to traditional heat sink designs. Its aluminum construction provides excellent heat dissipation capability and is corrosion and vibration resistant. The finned design gives it superior convection cooling capabilities while its small profile allows for use in areas with limited space. Additionally, it has excellent air flow characteristics which can be further enhanced by adding a fan to the unit.
The ATS-15C-50-C3-R0 is a versatile thermal-heat sink that can be used for a wide range of applications. Its stacked fin design allows for efficient heat dissipation while its small profile makes it suitable for use in confined spaces. It is also corrosion and vibration resistant, and its air flow characteristics can be further enhanced with the addition of a fan. Overall, the ATS-15C-50-C3-R0 is an excellent choice for thermal management and can be used in a variety of electronic products.
The specific data is subject to PDF, and the above content is for reference