| Allicdata Part #: | ATS-15C-51-C3-R0-ND |
| Manufacturer Part#: |
ATS-15C-51-C3-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15C-51-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical element in determining the success of many electronics projects. The ATS-15C-51-C3-R0 is a thermal/heat sink designed for applications in consumer electronics, networking equipment, automotive electronics, telecom, laptops, medical devices, and more. This device helps dissipate heat generated by components in these applications, preventing the system\'s processors and other electronics from overheating.
The ATS-15C-51-C3-R0 is a thin-profile, 15mm-tall, cross-fin heat sink with a three-piece design. It’s designed to be used with a range of motor drive modules, system-on-module, PTE, and adjacent memory. While the device is a small footprint and height, it also provides up to 3.6 W/mK thermal performance, a thermal resistance of 0.31 °C/W, and a thermal conductivity of 2.5 W/m.K, depending on the application. Maximum wattage dissipation is 4.8 W total.
The device is constructed from a lightweight aluminum extruded aluminum frame and nickel-plated copper heat spreader, providing the best thermal performance for a wide variety of environments. It also features an integrated adhesive thermal pad that serves to retain the heat sink to the substrate in applications that require bonding. The heat sink is RoHS-compliant and meets all industry standards and certifications.
The ATS-15C-51-C3-R0 heat sink works by absorbing and dissipating the heat generated by the component by convection. Air is propelled through the fins of the heat sink as it absorbs the heat generated from the component, cooling it down before conducting it away. This process helps keep the component and other nearby components from overheating, optimizing their performance and helping to prevent any premature breakage due to overheating.
The ATS-15C-51-C3-R0 heat sink is an ideal solution for thermal management in a variety of applications. Its lightweight construction, small size, and high thermal performance make it a great choice for applications that require a thin-profile and reliable thermal performance. With its integrated adhesive thermal pad, the ATS-15C-51-C3-R0 ensures that heat is dissipated efficiently, helping to prevent components from overheating and preventing any premature breakage.
The specific data is subject to PDF, and the above content is for reference