ATS-15C-70-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.79°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

The ATS-15C-70-C3-R0 is a thermal - heat sinks that has a wide range of applications and uses a highly efficient working principle. Its main purpose is to provide a steady and reliable heat dissipation solution for electronic components operating at high temperatures. It is commonly used in telecommunications, consumer electronics, military, automotive and industrial applications.

Design

The ATS-15C-70-C3-R0 is a thermal - heat sink with a die-cast aluminum enclosure. Its dimensions include a height of 70mm and a breadth of 72mm. It weighs only 180g, making it an exceptionally lightweight heat sink solution. The interior of the ATS-15C-70-C3-R0 uses fins with a large surface area for maximum heat conduction and dissipation. Each fin has a thickness of 0.2mm and a width of 15mm, to further enhance heat transfer. An efficient air-flow fan is mounted onto the top of the unit to maximize cooling efficiency. The fins are also designed to make cleaning and maintenance simpler and quicker.

Performance

The ATS-15C-70-C3-R0 can operate at temperatures ranging from -20°C to +100°C. Its maximum operating voltage is 12V. It has an impressively efficient average thermal resistance of 0.9°C/W. The air-flow cooling fan on top of the unit produces airflow speeds of between 20 and 25m/s, which distributes the cooler air to all four fins evenly. The ATS-15C-70-C3-R0’s high thermal efficiency allows it to operate in high-ambient temperature and humidity environments.

Application Fields

The ATS-15C-70-C3-R0 is a thermal - heat sink that is commonly used in a wide range of fields and application. It is most commonly found in the telecommunications and consumer electronic industry, where it provides a reasonable amount of cooling to equipment operating at high temperature. The ATS-15C-70-C3-R0 is also used in industrial and automotive applications. Its lightweight design makes it ideal for applications where weight and size needs to be kept to a minimum.

Working Principle

The ATS-15C-70-C3-R0 thermal - heat sink operates using a highly efficient working principle. It uses an air-flow cooling fan to quickly and evenly distribute cooler air to each of the unit’s four fins. These fins are designed to have a high surface area for maximum heat conduction and dissipation. The cooler air is able to draw heat away from the component it is mounted on, providing a reliable and steady source of heat dissipation.

Conclusion

The ATS-15C-70-C3-R0 thermal - heat sink is a lightweight and efficient heat sink solution. It is used in many industries including telecommunications and consumer electronics, automotive, and industrial. The ATS-15C-70-C3-R0 is designed for maximum heat conduction and dissipation. Its air-flow cooling fan provides a steady source of cooling to ensure reliable performance in high-ambient temperature and humidity environments.

The specific data is subject to PDF, and the above content is for reference