ATS-15C-90-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.33°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

Heat sinks are a form of cooling in which an external metal surface is exposed to air or another coolant in order to dissipate heat from an integrated circuit or other device that has generated excess heat. Heat sinks typically use a combination of conduction and convection to transfer heat away from a heated object, and are often used in applications where conventional air cooling is not effective.

One of the most common types of heat sinks is the ATS-15C-90-C1-R0 (ATS) heat sink. The ATS heat sink is designed for medium to high power electronic cooling applications with an operating temperature range from -20°C to +200°C. The heat sink is constructed from a plate heat exchanger and dissipates heat by convection and radiation, which is often necessary in tight, shallow-depth spaces.

The ATS heat sink is designed for ease of installation with simple mounting provisions. It features two mounting holes for easy installation onto a variety of embedded and surface mount devices. The heat sink is also designed to provide optimal cooling performance at a low cost.

The ATS has an efficient thermal interface material and cooling fins, allowing for a large range of mounting applications. It is suitable for thermal properties in a variety of environments, including high-temperature applications. The heat sink’s construction utilizes a combination of aluminum alloy and copper. The aluminum alloy has a high thermal conductivity that is ideal for high power applications, while the copper provides low thermal resistance and a low temperature rise.

The ATS heat sink is designed for effective heat dissipation, even when it is tightly packed against other components. The horizontal fins and low profile design help to ensure that the heat sink is flush against the mounting surface. In addition, the heat sink is designed with a tapered air gap which maximizes the air’s flow up through the fins, providing for an even distribution of cooling power.

The ATS heat sink is an effective way to transfer heat away from an object. It is lightweight, reliable, and relatively affordable. Its minimal design and slim profile make it well suited for devices with limited space, while its efficient design allows it to provide superior thermal performance in a variety of applications.

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