| Allicdata Part #: | ATS-15C-98-C3-R0-ND |
| Manufacturer Part#: |
ATS-15C-98-C3-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15C-98-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.79386 |
| 30 +: | $ 3.58323 |
| 50 +: | $ 3.37239 |
| 100 +: | $ 3.16159 |
| 250 +: | $ 2.95082 |
| 500 +: | $ 2.74005 |
| 1000 +: | $ 2.68736 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.39°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are essential components which are used for active cooling in a wide range of electronic devices and systems. The ATS-15C-98-C3-R0 Heat Sink series is a member of the leading product family of heat sinks designed to meet the high-performance cooling needs of today\'s electronics industry.
The ATS-15C-98-C3-R0 series features a low-profile aluminum alloy base and a modular heat pipe system. The heat pipe system features a copper core construction which ensures efficient heat transfer and maximum air flow. The heat pipe is connected to the base by means of a patent-pending liquid-thermal-cone technology, which bridges the gap between the base and the heat pipe and allows air to flow freely over the entire surface of the base. This ensures maximum efficiency in heat transfer and maximum cooling capability.
The ATS-15C-98-C3-R0 heat sink series is designed for a wide range of applications. It is suitable for use with embedded processors, high-speed memory modules, and power electronics for applications such as servers, telecommunications, computer peripherals, consumer electronics, automotive electronics, and industrial applications. It can also be used for cooling applications in clean environments such as laboratories and hospitals.
The ATS-15C-98-C3-R0 heat sink series is designed to provide superior performance in a wide range of environmental conditions. It has a thermal resistance of 0.2 K/W, which ensures that the heat sink can maintain a low-temperature environment even under extreme conditions. The low profile design of the base ensures minimal space requirements, and the aluminum alloy construction ensures strength and durability.
The ATS-15C-98-C3-R0 heat sink series is designed to operate at a temperature range of -40 to 85 °C. The thermal resistance can be adjusted by a simple turning mechanism, which allows the user to adjust the heat sink performance to match the particular specifications of their system or application. The heat sink series is also available with the optional air duct system for improved cooling performance and air circulation.
The ATS-15C-98-C3-R0 heat sink series is an excellent cooling solution for a wide variety of electronic devices and systems. Its low profile design, high thermal efficiency, and durable construction make it ideal for use in harsh environments, providing reliable performance and superior cooling.
The specific data is subject to PDF, and the above content is for reference