ATS-15D-10-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-15D-10-C3-R0-ND

Manufacturer Part#:

ATS-15D-10-C3-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-15D-10-C3-R0 datasheetATS-15D-10-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.57399
30 +: $ 3.37554
50 +: $ 3.17696
100 +: $ 2.97845
250 +: $ 2.77989
500 +: $ 2.58133
1000 +: $ 2.53168
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal management is an important aspect in mechanical engineering, for it is essential in the efficient operation of a variety of machinery and equipment. The use of thermal-heat sinks is an important component of thermal management, as these sinks provide an effective method of cooling a system. The ATS-15D-10-C3-R0 heat sink is one such device, and in this article we will discuss the applications and working principle of this particular thermal-heat sink.

The ATS-15D-10-C3-R0 heat sink is a single-stage device designed to dissipate excess heat from electrical components. It is a passive device made of an alloy of copper and aluminum, with a fin pattern of 12-15 fins per square inch. The fins are designed to dissipate the heat away from the component and into the air. The heat sink also contains an integral frame for mounting, allowing for easy installation in most applications.

One of the main applications of the ATS-15D-10-C3- R0 heat sink is in the cooling of high-powered electronics. It can be used in the cooling of power electronics such as processors, graphics cards, hard disks, and other power-hungry components. The device can dissipate large amounts of heat in a very short amount of time, allowing for efficient cooling of these components. The heat sink also reduces the overall energy consumption of the system, as it is able to transfer the heat away from the component more quickly than other cooling methods. As such, it is an effective and efficient cooling solution for high-powered electronic devices.

In addition to cooling high-power electronics, the ATS-15D-10-C3-R0 heat sink is also used in the cooling of small motors and other mechanical components. The device can dissipate the heat away from the component at a faster rate than any other cooling method, making it an ideal choice for cooling small motors and other moving parts. The device is also capable of dissipating additional heat away from the component, which can be used to increase the system’s overall efficiency.

The main working principle of the ATS-15D-10-C3-R0 heat sink is the use of convection. The device’s frame and fins are designed to provide a large surface area, which allows air to come into contact with the component and absorb the heat. As the air passes by the component, it takes the heat away from it and dissipates it into the atmosphere. This allows for efficient cooling of the component.

The ATS-15D-10-C3-R0 heat sink is an effective and efficient cooling solution for a variety of applications. It is a single-stage device made of an alloy of copper and aluminum, with a fin pattern of 12-15 fins per square inch. The device is designed to dissipate large amounts of heat away from components quickly and efficiently, making it ideal for cooling high-powered electronics and small motors. The working principle behind the device is the use of convection to dissipate the heat away from the component, making it an effective cooling solution. As such, the ATS-15D-10-C3-R0 heat sink is a great choice for thermal management, and will provide reliable and efficient cooling for a variety of mechanical and electrical components.

The specific data is subject to PDF, and the above content is for reference

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