ATS-15D-117-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-15D-117-C1-R0-ND

Manufacturer Part#:

ATS-15D-117-C1-R0

Price: $ 3.09
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X10MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-15D-117-C1-R0 datasheetATS-15D-117-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.78208
30 +: $ 2.70669
50 +: $ 2.55629
100 +: $ 2.40591
250 +: $ 2.25553
500 +: $ 2.18034
1000 +: $ 1.95479
Stock 1000Can Ship Immediately
$ 3.09
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.46°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management of electronic components is an important factor in system design and system functionality. One of the most commonly used thermal management solutions is the use of heat sinks, which are used to dissipate heat generated by electronic components. The ATS-15D-117-C1-R0 is a type of thermal-heat sink that is designed to provide superior heat dissipation performance.The ATS-15D-117-C1-R0 is designed for use in a wide range of applications, including consumer electronics, automotive, industrial electronics, marine, computer, and telecom. It features a optimized fin geometry to facilitate efficient heat exchange and an optimized extrusion profile for increased stiffness and rigidity. The heat sink is comprised of an aluminum extrusion and mounting hardware. It also includes a thermal interface material that serves to increase the heat transfer between the component and the heat sink.The ATS-15D-117-C1-R0 is designed to perform at high temperatures, with an operating temperature range from -20°C to +70°C and a storage temperature range of -40°C to +125°C. It is designed to dissipate up to 15W of heat from discrete electronic components. The efficient fin geometry of the heat sink helps to ensure effective cooling, while the optimized extrusion profile offers increased reliability and performance. The working principle of the ATS-15D-117-C1-R0 is quite straightforward. Heat generated from the electronic components is transferred to the heat sink through a thermal interface material. The heat is then dissipated to the surrounding air using convection. The extruded fins of the heat sink help to optimize heat dissipation, while the optimized extrusion profile helps to ensure rigidity and reliable performance.In conclusion, the ATS-15D-117-C1-R0 is a versatile heat sink designed for use in a wide range of applications. It is engineered for efficient heat dissipation, boasting a optimized fin geometry and an optimized extrusion profile for increased rigidity and reliability. With its wide temperature range, the ATS-15D-117-C1-R0 is capable of dissipating up to 15W of heat from discrete electronic components, making it an ideal thermal-heat sink solution for a variety of electronic systems.

The specific data is subject to PDF, and the above content is for reference

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