| Allicdata Part #: | ATS-15D-123-C1-R0-ND |
| Manufacturer Part#: |
ATS-15D-123-C1-R0 |
| Price: | $ 3.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15D-123-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.09078 |
| 30 +: | $ 3.00741 |
| 50 +: | $ 2.84029 |
| 100 +: | $ 2.67322 |
| 250 +: | $ 2.50614 |
| 500 +: | $ 2.42260 |
| 1000 +: | $ 2.17199 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become increasingly important in electronics due to the increasingly sophisticated components that are required in today’s world. ATS-15D-123-C1-R0 is a thermal heat sink designed to dissipate heat from high performance chips, allowing them to remain cooler and more efficient. This product acts as a buffer between components and the external environment and is essential in creating a comfortable and safe workspace.
The ATS-15D-123-C1-R0 is constructed from high quality aluminum with a thermal resistance of 0.15 oC/W and a thermal conductivity of 2.25 W/mK. It is designed to evenly disperse heat away from the core of a thermal hot spot. Its dimensions are 33.5 mm X 32 mm X 15 mm and it comes in a variety of colors.
This device is primarily used in high performance microelectronic devices such as CPUs, GPUs, and microprocessors. It is also used in LED lighting fixtures, computer expansion boards, and other high power electronic devices. Its low thermal resistance and high thermal conductivity make it an ideal choice for these applications.
The ATS-15D-123-C1-R0 works by transferring heat away from the microelectronic device to a large area. It is constructed with several small fins whose surface area is much greater than the core of the device itself. These fins increase the area for heat transfer, allowing heat to be quickly and efficiently dissipated from the device.
The heat sink is installed onto the microelectronic device using a clip. This allows for easy installation and removal. It has a variety of mounting options, including clip mount, through-hole mount, and double sided tape. It can also be secured with a variety of fastening mechanisms such as screws and nuts.
The device is also designed with an integrated fan and heat pipe. The fan is used to cool the fins on the device, increasing its effectiveness. The heat pipe allows heat to be conducted away from the core of the device in an efficient manner.
The entire device is designed to be highly efficient and reliable. It is rated for a wide range of temperatures, from -40 oC to +85 oC. It is also corrosion and oxidation resistant, making it suitable for long-term use. It is UL approved and comes with a two year manufacturer\'s warranty.
In conclusion, the ATS-15D-123-C1-R0 is a thermal heat sink designed to dissipate heat from high performance chips, allowing them to remain cooler and more efficient. Its high thermal resistance and thermal conductivity make it an ideal choice for cooling electronics. It is easy to install and comes with a variety of mounting options, making it a versatile device. It also comes with an integrated fan and heat pipe, ensuring efficient heat transfer from the core of the device.
The specific data is subject to PDF, and the above content is for reference