| Allicdata Part #: | ATS-15D-132-C3-R0-ND |
| Manufacturer Part#: |
ATS-15D-132-C3-R0 |
| Price: | $ 5.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15D-132-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.70799 |
| 30 +: | $ 4.44612 |
| 50 +: | $ 4.18459 |
| 100 +: | $ 3.92307 |
| 250 +: | $ 3.66153 |
| 500 +: | $ 3.40000 |
| 1000 +: | $ 3.33462 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.72°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction: Thermal-heat sinks, also known as heat spreaders, are used to protect electrical and electronic components, as well as the systems to which they are connected, from excessive heat. This is of particular importance when running high-performance devices that may generate large amounts of heat that would otherwise be dissipated into the surrounding environment. The ATS-15D-132-C3-R0 heat sink is one such device. The purpose of this article is to explore the application field and working principle of the ATS-15D-132-C3-R0 heat sink.
Application Field of the ATS-15D-132-C3-R0 Heat Sink: The ATS-15D-132-C3-R0 heat sink is ideal for use in consumer electronics, industrial equipment, medical devices, and limited-space areas where a small footprint is necessary. Its low-profile design is suitable for applications where a low-profile cooling solution is necessary. The device can be used with a variety of components such as CPUs, GPUs, APUs, and other heat-generating system components.
Working Principle of the ATS-15D-132-C3-R0 Heat Sink: The ATS-15D-132-C3-R0 heat sink works by absorbing and dissipating the heat generated by electronic components. This is achieved by using a combination of materials and manufacturing processes that create a highly efficient heat transfer path. At the core of the ATS-15D-132-C3-R0 heat sink are an array of wavy aluminium fins that are spaced apart. These fins help to increase the surface area and provide a greater contact area for heat conduction. The aluminium is designed to have a high thermal conductivity, thus allowing it to draw heat away from the component quickly and effectively.
In addition to the aluminium fins, the ATS-15D-132-C3-R0 heat sink also utilises a combination of copper, steel, and graphite. Graphite is a low-density, lightweight material with a very high thermal conductivity. This makes it ideal for heat dissipation and helps to ensure that the heat generated by the component is efficiently dissipated and does not cause any damage. Copper and steel are used to strengthen the housing and provide additional support for the fins. Combined, these materials allow the ATS-15D-132-C3-R0 heat sink to protect components from excessive heat in a wide range of applications.
Conclusion: The ATS-15D-132-C3-R0 heat sink is a highly effective cooling solution designed to protect electronic and electrical components from excessive heat. It is suitable for a variety of applications and is capable of efficiently dissipating heat due to its combination of aluminium, copper, steel, and graphite materials. With its low-profile design, the ATS-15D-132-C3-R0 heat sink is ideal for a range of limited space applications.
The specific data is subject to PDF, and the above content is for reference