| Allicdata Part #: | ATS-15D-14-C3-R0-ND |
| Manufacturer Part#: |
ATS-15D-14-C3-R0 |
| Price: | $ 4.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15D-14-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.74787 |
| 30 +: | $ 3.53934 |
| 50 +: | $ 3.33119 |
| 100 +: | $ 3.12304 |
| 250 +: | $ 2.91483 |
| 500 +: | $ 2.70663 |
| 1000 +: | $ 2.65458 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A heat sink is a component core to many electronic and thermal systems. It is used to dissipate thermal energy away from the core components or devices, and is typically composed of metal fins, ceramic, or liquid fillings. The ATS-15D-14-C3-R0 is a type of thermal heat sink that uses a unique combination of ceramic and metal fins to provide effective heat dissipation.
The ATS-15D-14-C3-R0 heat sink is designed to transfer heat away from high-power components or devices. It is commonly used in thermal systems, such as cooling fan drives, CPU and power supply modules, or in high-load systems such as 3D processors and multi-GPU systems. With its special combination of ceramic and metal fins, the ATS-15D-14-C3-R0 is capable of dispersing thermal energy quickly and efficiently, helping to cool the system down overall.
The ATS-15D-14-C3-R0 heat sink is designed with a unique airflow system that provides efficient thermal confinement. This airflow system operates by drawing air through a series of metal fins that are evenly spaced apart, allowing the heat to dissipate and spread throughout the fins. This rapidly dissipates the heat, drastically lowering the overall temperature of the device. The ceramic and metal fins of the ATS-15D-14-C3-R0 are engineered to absorb more of the heat than standard heat sinks, thus providing even more effective heat dispersion.
The ATS-15D-14-C3-R0 heatsink is also capable of providing superior thermal conduction. This is accomplished through the height-optimized design of the metal fins, which creates an ideal air speed for the rapid heat dissipation. Furthermore, the evenly spaced fins assist in providing an even and uniform rate of heat transfer over the entire fin surface, helping to ensure the greatest air speed efficiency in the system. Additionally, the fins are designed with a stepped shape, which helps to reduce the wind resistance and decrease the overall airflow path. This further improves the heat transfer rate and helps to keep the system cool and efficient.
To ensure that the ATS-15D-14-C3-R0 heat sink will provide optimal cooling performance, it must be installed properly. The heat sink should be mounted securely onto the device or component, with the air flow directly affecting the fin surfaces. For best results, be sure to mount the heat sink as close as possible to the device or component, as this will maximize the air flow and cooling efficiency. Finally, correct thermal paste should be applied to the bottom of the heat sink to ensure proper heat conduction.
The ATS-15D-14-C3-R0 thermal heat sink is a great option for many thermal systems. Its combination of ceramic and metal fins make it perfect for efficient heat transfer, while its height-optimized design is ideal for maximizing air speed and reducing wind resistance. Combined with proper installation procedures, the ATS-15D-14-C3-R0 will provide excellent cooling performance and help keep your electronics cool and stable.
The specific data is subject to PDF, and the above content is for reference