| Allicdata Part #: | ATS-15D-141-C1-R0-ND |
| Manufacturer Part#: |
ATS-15D-141-C1-R0 |
| Price: | $ 3.27 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15D-141-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.97234 |
| 30 +: | $ 2.89170 |
| 50 +: | $ 2.73105 |
| 100 +: | $ 2.57040 |
| 250 +: | $ 2.40975 |
| 500 +: | $ 2.32942 |
| 1000 +: | $ 2.08845 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.66°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-15D-141-C1-R0 is a type of thermal-heat sink that is used in many applications. It is a type of heat sink that helps to dissipate heat from a given object, such as an electronic device, an automotive engine, or another type of electronic device.
This type of heat sink is typically composed of a metal, such as aluminum, copper, or steel, that has been shaped into a flat or profiled shape that allows for air to flow through it. The heat sink is designed to be placed on top of the device that needs to be cooled. As the device generates heat, the heat is transferred to the metal of the heat sink, which then dissipates the heat away from the device.
The ATS-15D-141-C1-R0 is often used in electronics applications such as audio amplifiers, power supplies, and computers. It is also used in automotive applications such as engines, transmissions, and exhaust systems. The heat sink can also be used in industrial applications, such as in air conditioning systems, to regulate the temperature within a specific area.
The ATS-15D-141-C1-R0 is designed to be mounted on the top or bottom of a device, and is usually secured to the device by screws. The heat sink is designed with fins or louvres that help to dissipate the heat efficiently from the device. These fins or louvres are usually made from the same metal as the heat sink, with the size and shape of the louvres being determined by the size of the device that needs cooling.
The working principle behind the ATS-15D-141-C1-R0 is based on the process of thermal conduction. This is the transfer of heat from one object to another due to a difference in temperatures. In the case of an electronic device, heat is generated within the device from the electrical currents used to power it. This heat is then transferred to the metal of the heat sink, which then dissipates it away from the device.
The ATS-15D-141-C1-R0 is an effective and affordable way to dissipate heat from a variety of electronic devices and automotive applications. It is also designed to be easily installed, which makes it an ideal choice for a wide range of applications. With its superior thermal conduction capabilities, the ATS-15D-141-C1-R0 is an excellent choice for those looking for an efficient and cost-effective way to keep their electronic devices and automotive engines cool.
The specific data is subject to PDF, and the above content is for reference