ATS-15D-167-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-15D-167-C1-R0-ND

Manufacturer Part#:

ATS-15D-167-C1-R0

Price: $ 3.12
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X20MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-15D-167-C1-R0 datasheetATS-15D-167-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.82933
30 +: $ 2.75289
50 +: $ 2.60001
100 +: $ 2.44705
250 +: $ 2.29408
500 +: $ 2.21761
1000 +: $ 1.98820
Stock 1000Can Ship Immediately
$ 3.12
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.03°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are increasingly being employed in a wide variety of applications, from large-scale industrial applications to small-scale domestic applications. The ATS-15D-167-C1-R0 is a popular choice for many of these applications. This heat sink features a unique combination of features and capabilities that makes it particularly well-suited to various environments. In this article, we will discuss the application field and working principle of the ATS-15D-167-C1-R0 heat sink.

The ATS-15D-167-C1-R0 is a high-performance, low-profile heat sink designed for use in a wide range of applications. It is an ideal choice for applications where space is limited and the heat dissipated needs to be limited. The ATS-15D-167-C1-R0 features an aluminum fin geometry with enhanced convection performance, as well as a large base plate area with tapped holes for mounting. In addition, the ATS-15D-167-C1-R0 is designed to work in temperatures up to 176°F (80°C).

The ATS-15D-167-C1-R0 heat sink is designed to dissipate the heat generated by the components it is attached to, such as processors, voltage regulator modules, and other electronics. It does this by transferring the heat away from the components through the aluminum fins, which form the sidewalls of the sink. The fins act as a large heatsink surface area, allowing the heat to dissipate quickly. Due to the thinness of the fins and the large amount of surface area, the ATS-15D-167-C1-R0 is an effective choice for both cooling and thermal management.

The ATS-15D-167-C1-R0 heat sink is designed to be mounted on an electronic component or device, as well as on a host system. It can be mounted using both standard mounting hardware or integrated with mounting plates and brackets. It is also designed to be easily installed, with no special tools or equipment required. Once installed, the heat sink can be used to cool the component or device it is attached to, and will also provide additional protection from shock and vibration.

The ATS-15D-167-C1-R0 heat sink can also be used to reduce system-wide noise. By providing an effective thermal management solution, the ATS-15D-167-C1-R0 can reduce system operating temperatures and reduce the increased noise associated with higher temperature components. This can be especially beneficial in applications where reduced noise is an important factor.

In addition to its thermal management capabilities, the ATS-15D-167-C1-R0 heat sink provides enhanced system protection. The sink\'s design ensures that components are kept cool, even if the cooling fan fails or is not operational. This can help to ensure that the components remain safe from damage caused by thermal stress or excessive heat. In addition, the ATS-15D-167-C1-R0 features a corrosion-resistant coating that helps to protect against potential damage from environmental elements.

The ATS-15D-167-C1-R0 heat sink is a versatile, low-profile solution for a wide variety of thermal management applications. It is a highly effective choice for applications where space is limited and thermal management is critical. Its combination of features and capabilities make it an ideal solution for many applications, from large-scale industrial applications to small-scale domestic situations.

The specific data is subject to PDF, and the above content is for reference

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