| Allicdata Part #: | ATS-15D-197-C1-R0-ND |
| Manufacturer Part#: |
ATS-15D-197-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15D-197-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.80539 |
| 30 +: | $ 2.72979 |
| 50 +: | $ 2.57809 |
| 100 +: | $ 2.42645 |
| 250 +: | $ 2.27480 |
| 500 +: | $ 2.19898 |
| 1000 +: | $ 1.97149 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are components used in a variety of electronic devices to dissipate heat from components within the device. They are important in preventing components from reaching their thermal limits and are essential for the proper functioning of the device. ATS-15D-197-C1-R0 is a type of thermal heat sink specifically designed for use in telecommunications and computing applications. This article will discuss the application field of the ATS-15D-197-C1-R0, as well as its working principle.
Application Field of ATS-15D-197-C1-R0
The ATS-15D-197-C1-R0 is specifically designed to dissipate heat from components within telecommunications and computing applications. It is capable of dissipating up to 25 W in a very small package, which makes it ideally suited for use in a variety of telecom and computing devices. Furthermore, it is designed to function in a range of temperatures, from -40°C up to +85°C. This makes it suitable for use in both extremely cold and hot environments. In addition, the ATS-15D-197-C1-R0 has an efficient thermal design, which allows it to offer excellent heat dissipation performance.
Working Principle of ATS-15D-197-C1-R0
The ATS-15D-197-C1-R0 uses a phase change material (PCM) as its primary heat transfer medium. The PCM is a wax-like substance that is solid at room temperature, but when heated, it turns into a liquid. This liquid then transfers heat from the component to the outside environment. The PCM is contained within a sealed cavity in the ATS-15D-197-C1-R0, which is then filled with a thermal compound. The thermal compound helps to transfer the heat from the component to the PCM. As the PCM absorbs the heat from the component, it liquefies and the heat is then transferred to the outside environment.
The ATS-15D-197-C1-R0 also features a highly efficient design, which allows it to dissipate heat more effectively. The design includes two heat pipes, which run alongside the PCM, and a large fin array. The heat pipes help to transfer the heat from the center of the device, which is where the PCM is located, to the fin array. The fins help to dissipate the heat from the device faster, ensuring that it does not reach thermal limits.
Conclusion
The ATS-15D-197-C1-R0 is a type of thermal heat sink designed for use in telecommunications and computing applications. It features an efficient design, allowing for effective heat transfer and dissipation. The device is filled with a PCM which liquefies when heated and transfers the heat from the component to the outside environment. The design also includes two heat pipes and a large fin array, which help to dissipate the heat faster and prevent components from reaching their thermal limits. In summary, the ATS-15D-197-C1-R0 is an ideal thermal heat sink for use in a variety of telecom and computing applications.
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