| Allicdata Part #: | ATS25530-ND |
| Manufacturer Part#: |
ATS-15D-20-C2-R0 |
| Price: | $ 4.98 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-15D-20-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.52970 |
| 10 +: | $ 4.40685 |
| 25 +: | $ 4.16203 |
| 50 +: | $ 3.91734 |
| 100 +: | $ 3.67246 |
| 250 +: | $ 3.42763 |
| 500 +: | $ 3.18280 |
| 1000 +: | $ 3.12159 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management and heat sinking have been essential components of electronics design for many years. Furthermore, the rapid development of consumer electronics has led to the need for more efficient and powerful cooling solutions. The ATS-15D-20-C2-R0 thermal solution is a type of heat sink designed to meet the increasing demands of modern technology. It is an aluminum heat sink with a range of thermal performance characteristics to suit almost any application.
The ATS-15D-20-C2-R0 is a single-phase heat sink made of aluminum. The thermal solution features a symmetrical, curved fin design and can accommodate up to three fan blades for increased cooling performance. The aluminum fin geometry ensures an even cooling rate and uniform temperature distribution across the heat sink surface. With a fin area of 1.1 mm² per fan, the ATS-15D-20-C2-R0 allows for up to twice the amount of air circulation as traditional heat sinks. It is also designed with optimized clearance to ensure maximum utilization of each fin.
The ATS-15D-20-C2-R0 has an air flow rate of up to 33 CFM and a thermal resistance of 0.10 °C/W. This makes it an ideal solution for applications requiring high heat dissipation and low temperature rise. It is suitable for a diverse range of applications, including power electronics, LED lighting, telecommunications and motor drives. The fanless, low-noise design ensures minimal noise and vibration, allowing for easy integration into any system.
The working principle of the ATS-15D-20-C2-R0 heat sink is based on the science of thermal management. Heat from the hot electronic components is drawn away by the fins and fins gap spacing, then dissipated by the air flow. The thermal resistance of the heat sink can be adjusted by changing the air flow rate or the gap spacing between the fins. By tuning the airflow, the heat sink can be optimized for different applications, ensuring the best performance and highest efficiency.
The ATS-15D-20-C2-R0 heat sink is an innovative and reliable thermal solution designed to meet the cooling demands of modern electronics. Its efficient and uniform heat dissipation, high air flow rate, and low thermal resistance make it well suited to many applications. The ATS-15D-20-C2-R0 is an ideal choice for thermal management in power electronics, LED lighting, telecommunications, and motor drives.
The specific data is subject to PDF, and the above content is for reference
ATS-15D-20-C2-R0 Datasheet/PDF