
Allicdata Part #: | ATS-15D-203-C1-R0-ND |
Manufacturer Part#: |
ATS-15D-203-C1-R0 |
Price: | $ 3.31 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 54X54X10MM XCUT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.00762 |
30 +: | $ 2.92635 |
50 +: | $ 2.76381 |
100 +: | $ 2.60127 |
250 +: | $ 2.43868 |
500 +: | $ 2.35738 |
1000 +: | $ 2.11351 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.126" (54.01mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 8.91°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are important components used in cooling applications that involve heat extraction from an electronic device or system. Thermal heat sinks, in particular, are designed to absorb heat and distribute it away from its source by means of a surface area that facilitates the transfer of heat through convection or radiation. The ATS-15D-203-C1-R0 is an example of a thermal heat sink, designed to do the same in a variety of applications.
The ATS-15D-203-C1-R0 is a professionally designed heat sink with a 30-pin package made of heavy-duty copper for maximum heat sink efficiency. The heat sink is designed to dissipate thermal energy of up to 30 watts and have a maximum temperature of 65 degrees Celsius. Offering an extruded aluminum base with fins for an optimal thermal efficiency of up to 90% and an improved dissipation rate, the ATS-15D-203-C1-R0 has been tested and certified to meet international quality standards and is suitable for use in a wide range of applications.
The ATS-15D-203-C1-R0 thermal heat sink is used in three primary application fields: heat dissipation of power electronics, high-power radio frequency applications and LED lighting applications. In power electronics, the heat sink helps to dissipate excess heat produced by power transistors, rectifiers, and other such semiconductor devices. This helps to protect the device from damage and improve its reliability. For high-power RF applications, the ATS-15D-203-C1-R0 is also used to dissipate any unwanted thermal energy generated by RF components in order to prevent the device from malfunctioning. Finally, the thermal heat sink is often used in LED lighting applications, as the large surface area of the heat sink helps to dissipate the significant amount of heat generated by the LEDs, which helps to extend their lifespan and improve performance.
The principle of operation for the ATS-15D-203-C1-R0 thermal heat sink is based on the principle of convection, where warm air rises, cools and is replaced by a new stream of air. This convection process is driven by the airflow that is created when the heat sink is subjected to a ventilation system, such as a fan. The heat sink also takes advantage of the natural convection currents in the surrounding air due to its low profile and wide surface area. As warmer air rises, it is replaced by cooler air, and the heat is removed from the heat source.
The ATS-15D-203-C1-R0 thermal heat sink is a specific example of a thermal heat sink, designed to be used in a variety of applications. This heat sink is designed to dissipate heat of up to 30 watts and has a maximum temperature of 65 degrees Celsius. Its primary applications are in heat dissipation of power electronics, high-power RF applications, and LED lighting applications. The heat sink operates on the principle of convection, taking advantage of both natural and forced convection currents in order to efficiently transfer heat away from the heat source.
The specific data is subject to PDF, and the above content is for reference