ATS-15D-25-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-15D-25-C3-R0-ND

Manufacturer Part#:

ATS-15D-25-C3-R0

Price: $ 5.68
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-15D-25-C3-R0 datasheetATS-15D-25-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.11245
30 +: $ 4.82853
50 +: $ 4.54444
100 +: $ 4.26044
250 +: $ 3.97641
500 +: $ 3.69238
1000 +: $ 3.62137
Stock 1000Can Ship Immediately
$ 5.68
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.32°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-15D-25-C3-R0 is a thermal heat sink from ATS Automation. A thermal heat sink is a device that is used to dissipate the heat generated by an electronic device, allowing it to stay at a safe operating temperature. The ATS-15D-25-C3-R0 is designed to provide a robust solution to cooling in a variety of applications, making it a popular choice for electronics enthusiasts.

The ATS-15D-25-C3-R0 makes use of a combination of natural and forced convection to efficiently transfer heat away from a device and dissipate it into the surrounding air. The sink features a large array of aluminum fins arranged in a sawtooth formation, which are spaced closely together to maximize the surface area available for heat dissipation. The fins are left open to allow air to move freely across them, carrying away heat. The fins are also designed to be asymmetrical, which helps to ensure that air flows smoothly across them without creating turbulence.

To maximize the efficiency of the ATS-15D-25-C3-R0, a fan is used to provide active cooling. The fan draws air in from the environment and forces it across the fins of the heat sink, carrying the heat away from the device. In addition to providing active cooling, the fan also helps to create a more consistent air flow and reduce the chances of air turbulence that can reduce the heat sink’s effectiveness.

The ATS-15D-25-C3-R0 is a popular choice for cooling electronic components in many different applications. It is an ideal choice for large and powerful components, such as CPUs and GPUs in desktop and laptop computers, as well as for smaller components and devices such as memory modules and flash drives. It is also suitable for a wide range of other applications, such as networking, and telecoms.

In addition to providing effective cooling, the ATS-15D-25-C3-R0 is also designed to be lightweight and compact. This makes it easy to incorporate into a wide range of designs, and the low profile design makes it ideal for use in confined spaces. The heat sink also features a robust construction, making it durable enough to withstand a wide range of temperatures and environmental conditions.

The ATS-15D-25-C3-R0 is a great choice for anyone who needs a reliable and efficient way to cool electronic components. It offers a robust and compact design, as well as efficient heat transfer, all at a competitive price. With its combination of natural and forced convection, the ATS-15D-25-C3-R0 provides a reliable solution for keeping electronic devices at the optimum temperature.

The specific data is subject to PDF, and the above content is for reference

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