| Allicdata Part #: | ATS-15D-35-C1-R0-ND |
| Manufacturer Part#: |
ATS-15D-35-C1-R0 |
| Price: | $ 5.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X5.84MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15D-35-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.60341 |
| 30 +: | $ 4.34784 |
| 50 +: | $ 4.09210 |
| 100 +: | $ 3.83632 |
| 250 +: | $ 3.58057 |
| 500 +: | $ 3.32481 |
| 1000 +: | $ 3.26087 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.230" (5.84mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-15D-35-C1-R0 Heat Sink is a thermodynamic device designed to dissipate thermal energy from its surface to a cooler environment, often to air or water. This process is known as conduction cooling, and is beneficial in several applications. Heat sinks are most commonly used in electronic components and assemblies to ensure reliable operation in high-risk applications, such as space and automotive transmissions, as well as in extreme ambient temperatures.
The ATS-15D-35-C1-R0 is specifically designed for thermal management applications in high-temperature environments. This device has a pressed-fin thermal-connecting-section design that optimizes thermal transfer to provide reliable performance in the most demanding electrical systems. Its fins are kept at a constant temperature using an air flow process, which helps to dissipate heat quickly and efficiently.
The versatile design of the ATS-15D-35-C1-R0 also allows for easy installation in a variety of enclosures. Its low profile design requires minimal space within the enclosure, while the flat surface and fins ensure easy bond with the walls. Additionally, its bolt-on, reversible mounting feature allows it to be used in a wide variety of applications.
The main function of the ATS-15D-35-C1-R0 is to conduct heat away from where it was generated, and dissipate it to the environment surrounding it. Heat is generated by electrical components, such as CPUs, GPUs, and transistors, which then transfers the heat to the heat sink through either conduction or convection, depending on the design. The heat sink then dissipates the heat to its surrounding environment, either by radiation or convection, depending on the environment.
The ATS-15D-35-C1-R0 also boasts a variety of features that make it ideal for thermal management. It features a built-in fan that helps to cool the components more efficiently, even in extreme ambient temperatures. Additionally, its aluminum construction and high thermal conductivity ensures the that the heat is transferred to the environment quickly and evenly, and its bolted mounting cushions shock and vibration.
The ATS-15D-35-C1-R0 is an ideal device for applications requiring reliable thermal management in extreme ambient temperatures. Its efficient design and advanced features ensure maximum heat transfer and dissipation in even the most demanding environments. Its versatile design also allows for easy installation and maintenance, making it the perfect choice for a variety of applications.
The specific data is subject to PDF, and the above content is for reference