| Allicdata Part #: | ATS-15D-59-C3-R0-ND |
| Manufacturer Part#: |
ATS-15D-59-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15D-59-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-15D-59-C3-R0 thermal-heat sink is designed to dissipate and control the temperatures of electronic components. It is a critical part of the cooling system of any device, providing the ability to manage the temperature of the components.
The ATS-15D-59-C3-R0 heat sink consists of a metal extrusion into which multiple small fin’s are cut. These fins increase the surface area available to dissipate the heat. The ATS-15D-59-C3-R0 also incorporates a thermoelectric Peltier device, which is designed to efficiently transfer heat from one side to the other. The Peltier device provides temperature control and is what sets the ATS-15D-59-C3-R0 apart from other heat sinks. Other components featured on the ATS-15D-59-C3-R0 include a thermistor, a thermal resistance sensor which monitors the temperature within the heat sink, and a fan to increase airflow over the fins.
The ATS-15D-59-C3-R0 is used in a wide variety of applications, from personal consumer electronics to industrial controllers. It can be used in conjunction with other cooling solutions, such as fan cooling, liquid cooling, or a combination of the two.
Working Principle:
When the heat generated by a device is transferred to the ATS-15D-59-C3-R0 heat sink, the thermoelectric Peltier device uses the difference in temperatures on either side of the device to transfer the heat from one side to the other. The Peltier device works on the principle of the Seebeck effect, and the resulting cool side of the device is used to cool the electronic components. The fan is used to increase airflow over the fins and ensure that the heat is effectively dispersed. The thermal resistance sensor monitors the temperature within the heat sink, and can be used to control the temperature of the components by adjusting the speed of the fan accordingly.
The ATS-15D-59-C3-R0 thermal-heat sink is an effective solution for managing the temperature of electronic components. The Peltier device allows for accurate control of temperatures and the fan ensures effective heat dissipation from the components. The ATS-15D-59-C3-R0 is a versatile solution, offering excellent performance in a range of applications.
The specific data is subject to PDF, and the above content is for reference