ATS-15D-60-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.33°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal heat sinks are components designed to dissipate heat from various electrical components, such as transistors and integrated circuits. In order to dissipate heat effectively, a heat sink typically has a high thermal resistance and a low thermal mass. The most common type of heat sink is the ATS-15D-60-C1-R0.

Features of the ATS-15D-60-C1-R0 Thermal Heat Sink

The ATS-15D-60-C1-R0 has a low heat mass and broad thermal resistance surface that allow for efficient heat dissipation. The design consists of a two-piece base and a heat sink fin. The base is constructed from aluminum and features an attractive, air-cooled baffling system that helps to reduce turbulence noise. The fin is machined from 6061-T6 aluminum for superior heat dissipation. The fin is designed with multiple levels to allow for efficient air flow.The ATS-15D-60-C1-R0 has a minimal size of 68.8mm x 53.6mm and a height of 6mm, allowing it to fit into various applications. It also has a low maximum thermal resistance of 0.80 °C/W and a maximum ambient temperature rating of 70 °C, making it suitable for a range of thermal management applications.

Application Fields and Working Principle

The ATS-15D-60-C1-R0 thermal heat sink is used in a variety of electronic applications, such as power supplies, motor controls, audio amplifiers, scientific measurement devices, and LED lighting systems. It is an ideal solution for eliminating excessive heat and allows for the component to operate without being thermally affected.The working principle of the ATS-15D-60-C1-R0 is based on the three laws of thermodynamics. The first law of thermodynamics states that the energy in a system remains constant, meaning that heat (kinetic energy) is transferred from one part of the system to another. The second law of thermodynamics states that in isolated systems, entropy (disorder) tends to increase, meaning that heat energy tends to move from high concentration to low concentration. Finally, the third law of thermodynamics states that as temperature approaches absolute zero, entropy approaches a minimum value. The ATS-15D-60-C1-R0 utilizes these laws to transfer heat away from the electronic components. The heat generated by the electronic component is transferred to the aluminum base of the heat sink. The base of the heat sink is designed with a multiple-leveled fin that increases the surface area of the heat sink, allowing for increased thermal transfer. The aluminum fin also conducts heat efficiently, allowing heat to quickly move away from the component. The base is then air-cooled by natural convection, meaning that the cooler air surrounding the component will be drawn in and the warmer air over the fins will be expelled, thus allowing for efficient heat transfer.

Conclusion

The ATS-15D-60-C1-R0 thermal heat sink is a highly efficient and reliable solution for dissipating heat from electronic components. With its low heat mass, broad thermal resistance surface, and minimal size, it is suitable for a wide range of thermal management applications. Furthermore, the heat transferring process of the ATS-15D-60-C1-R0 is based on the laws of thermodynamics, making it a surefire method of eliminating excessive heat from electronics.

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