ATS-15D-60-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS25569-ND

Manufacturer Part#:

ATS-15D-60-C2-R0

Price: $ 4.63
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X35MM L-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-15D-60-C2-R0 datasheetATS-15D-60-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.20840
10 +: $ 4.09437
25 +: $ 3.86719
50 +: $ 3.63964
100 +: $ 3.41221
250 +: $ 3.18473
500 +: $ 2.95725
1000 +: $ 2.90037
Stock 1000Can Ship Immediately
$ 4.63
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.36°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal solutions have been in use for centuries, and are found in a variety of applications including home heating, industrial and commercial process cooling, medical and industrial equipment cooling, and many other applications. Heat sinks are thermal solutions that use metal or other materials to dissipate heat from a device. A Thermal – Heat Sink like the ATS-15D-60-C2-R0 utilizes a series of aluminum fins to quickly and effectively dissipate heat from the source device. The ATS-15D-60-C2-R0 is a unique heat sink that is designed to maximize thermal performance within a given envelope size.

The ATS-15D-60-C2-R0 consists of a series of densely spaced, straight aluminum fins that are extruded from a thermally conductive base. The base is then treated with a black electro-coating for durability. The fins are well spaced, allowing for cooling of nearby electronic components. The ATS-15D-60-C2-R0 is capable of dissipating up to 152 Watts of heat and features a great thermal resistance of 0.115 degrees Celsius per Watt.

The design of a heat sink is critical to ensure that it is able to dissipate the required amount of heat from a device. The ATS-15D-60-C2-R0 utilizes a series of aluminum fins to rapidly disperse heat. As air flows through the fins, it absorbs heat energy from the fins. The air then carries the heat away from the device, thus cooling it. The staggered lamellar design of the ATS-15D-60-C2-R0 provides a greater surface area for air to interact with, and for heat to be released from.

In addition to the heat sink’s design, its air flow rate is an important factor in achieving effective cooling. The ATS-15D-60-C2-R0 utilizes an air flow rate of 80 - 120 CFM to provide efficient cooling of the device. Additionally, the ATS-15D-60-C2-R0 is able to operate within a wide range of temperatures, between -22 °F and +176 °F, making it applicable for many types of electronic devices.

The ATS-15D-60-C2-R0 can be applied to a variety of applications, including power amplifiers, audio amplifiers, medical imaging systems, and more. Many of these applications produce large amounts of heat that require efficient cooling solutions. The ATS-15D-60-C2-R0 is an ideal option for these applications, thanks to its low profile design and exceptional thermal performance.

The ATS-15D-60-C2-R0 is a unique Thermal – Heat Sink designed to maximize thermal performance and provide efficient cooling for a wide range of applications. Its efficient design and air flow rate provide great cooling efficiency, and its ability to operate across a wide temperature range makes it an excellent choice for many types of applications. The ATS-15D-60-C2-R0 is the optimal choice for a variety of thermal solution applications.

The specific data is subject to PDF, and the above content is for reference

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