ATS-15E-01-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-15E-01-C3-R0-ND

Manufacturer Part#:

ATS-15E-01-C3-R0

Price: $ 3.45
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-15E-01-C3-R0 datasheetATS-15E-01-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.13866
30 +: $ 3.05361
50 +: $ 2.88401
100 +: $ 2.71435
250 +: $ 2.54470
500 +: $ 2.45987
1000 +: $ 2.20541
Stock 1000Can Ship Immediately
$ 3.45
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 22.05°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are highly important components in a wide variety of industries as they help maintain a steady temperature and prevent electronic components from overheating. The ATS-15E-01-C3-R0 is one of the most commonly used thermal-heat sinks, primarily due to its low profile design and its multi-feature capability. The ATS-15E-01-C3-R0 is an advanced thermal-heat sink designed for electrically efficient thermal management and cooling. This thermal-heat sink is made up of three separate parts: the base, the profiled fins, and a dielectric thermal-conductive material. The base is made of a rugged aluminum alloy, while the profiled fins are made from a high-temperature plastic. The dielectric thermal-conductive material is comprised of dielectric micro-pores that help to draw heat away from the components and dissipate it evenly. This helps to keep components running at optimal temperatures and prevents them from overheating. The profiled fins of the ATS-15E-01-C3-R0 are multi-functional and provide a number of different benefits. Firstly, they act as a heat spreader to evenly disperse heat from the components. Secondly, they also act as a thermal-barrier to help keep hot and cold air out of the components. Finally, they also serve as an air cooler to help reduce the temperature around the components. In addition to the above, the profiled fins are also designed to maintain a steady temperature even during high-demand operating conditions. This helps to minimize the risk of overheating, which can cause excess energy consumption and system shutdowns. Furthermore, the ATS-15E-01-C3-R0 also provides a wide variety of mounting options, including clips, screws, and "push-in" mounting. The ATS-15E-01-C3-R0 is an ideal choice for a wide variety of applications, including data centers, communications and industrial applications. Thanks to its low profile design, it is able to fit into tight spaces and provide effective cooling. Furthermore, it is also designed to work with a variety of components, ensuring that it can be used in any application. With its combination of low profile design, multi-functionality, and rugged construction, the ATS-15E-01-C3-R0 is an an excellent choice for cooling components in any application. Its advanced thermal management and cooling capabilities help to keep components running at top performance and helps to minimize the risk of overheating. Moreover, its wide variety of mounting options makes it a very versatile and cost-effective thermal-heat sink.

The specific data is subject to PDF, and the above content is for reference

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