ATS-15E-05-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.69°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-15E-05-C1-R0: Thermal – Heat Sinks Application Field and Working Principle

Thermal heat sinks are used to dissipate excessive heat away from electrical components. They do this by transferring the heat generated by the components away from them and into the surrounding air. The ATS-15E-05-C1-R0 heat sink model is specifically designed to efficiently cool down computers and other electronic devices that generate a lot of heat, such as high-end gaming systems or overclocked processors. In order to function effectively and efficiently, thermal heat sinks must be properly designed and implemented with the target application in mind. ATS-15E-05-C1-R0 is designed to cool the components to a temperature that is safe for their operation without consuming too much power. Additionally, the heat sink is curved to maximize the surface area to help more efficiently disperse the heat from the components.The ATS-15E-05-C1-R0 thermal heat sink has been designed to provide superior cooling performance while still encapsulating its components. The heat sink is composed of aluminum variously stamped, folded, and pressed into a tight, durable structure. Thermal paste is applied between the surface of the components and the heat sink to improve the thermal performance of the heat exchange. This combination of thermal paste and the aluminum structure works to absorb and transfers the heat away from the components.To ensure maximum cooling performance, the ATS-15E-05-C1-R0 has been designed with a number of features. The heat sink has a high thermal conductivity rating, ensuring it is able to quickly and efficiently dissipate heat away from its components. Finned design helps to dissipate heat quickly by increasing the surface area of the heat sink, which allows more air to pass through the fins and transfer the heat away from the components. Finally, the heat sink has a specific form factor which ensures it is properly able to fit into the various components and entry points of the device.The ATS-15E-05-C1-R0 thermal heat sink is an ideal solution for cooling down computers, gaming systems or processors that generate a high amount of heat. It is designed with superior performance in mind and is both lightweight and durable. The high thermal conductivity rating ensures that the heat is quickly dissipated away from the components, while its finned design further improves the heat dissipation. Finally, it has a form factor which enables it to fit into tight spaces and entry points, making it an ideal solution for tight spaces.

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