ATS-15E-09-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.56°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction to the ATS-15E-09-C1-R0 Thermal Heat Sink

The ATS-15E-09-C1-R0 thermal heat sink, also known as a heat exchanger, is a device that is used to improve the heat transfer properties of a system by conducting heat away from the source while also cooling the system. The ATS-15E-09-C1-R0 thermal heat sink is designed for both liquid and air cooled applications and is suitable for a wide range of temperatures and operating conditions.

Application Field of ATS-15E-09-C1-R0 Thermal Heat Sink

The ATS-15E-09-C1-R0 thermal heat sink is typically used in applications such as computers, telecommunications equipment, consumer electronics, and automotive components. The ATS-15E-09-C1-R0 is made from high-quality aluminum and offers excellent heat dissipation performance. It is also incredibly lightweight and has a sleek design, making it ideal for applications where space is limited. The ATS-15E-09-C1-R0 is also thermally conductive, meaning it has high efficiency and low power consumption. This makes it suitable for a wide range of applications, including limited space applications where high power density is required. The ATS-15E-09-C1-R0 thermal heat sink also offers superior heat transfer capabilities, excellent thermal stability, and high reliability.

Working Principle of ATS-15E-09-C1-R0 Thermal Heat Sink

The ATS-15E-09-C1-R0 thermal heat sink works by conductive heat transfer. Heat is conducted away from the source and into the thermal honeycomb structure of the heat sink, which further dissipates the heat. The design of the ATS-15E-09-C1-R0 thermal heat sink ensures optimal heat transfer and even heat distribution throughout the honeycomb structure. The ATS-15E-09-C1-R0 thermal heat sink is a passive cooling device, meaning it does not require any external power or source for its operation. The design of the heat sink also allows for a high level of efficiency and low operational noise. The ATS-15E-09-C1-R0 thermal heat sink also features a high reliability and durability rating, making it suitable for long-term, high temperature applications.

Conclusion

The ATS-15E-09-C1-R0 thermal heat sink is a highly reliable and efficient cooling device that is suitable for a wide range of applications. It is made from high-quality aluminum and offers excellent heat dissipation performance. It is also incredibly lightweight and has a sleek design, making it ideal for applications where space is limited. Thanks to its thermally conductive design and honeycomb structure, the ATS-15E-09-C1-R0 thermal heat sink also offers superior heat transfer capabilities, excellent thermal stability, and high reliability.

The specific data is subject to PDF, and the above content is for reference