| Allicdata Part #: | ATS-15E-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-15E-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15E-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-15E-10-C1-R0 is a thermal - heat sink that is designed to effectively dissipate heat in a broad range of applications and environments. It uses a combination of advanced materials and thermal engineering principles to optimize heat dissipation and increase the operational temperature of electrical and mechanical components and subsystems. This makes it an ideal solution for thermal management in a wide variety of applications.
The Thermal - Heat Sink uses a thermoelectric alloy with an optimization process that involves optimizing heat transfer through the alloy material. This process ensures that the Thermal - Heat Sink creates the highest thermal performance and also helps to reduce acoustic noise. In addition, the Thermal - Heat Sink also features a low thermal resistance design that ensures optimal heat conduction from the source to the sink.
The Thermal - Heat Sink’s design consists of a high-performance aluminum heatsink and a multidirectional fin configuration. The heatsink is designed such that it captures the heat from the source and rapidly dissipates it into the atmosphere. The multidirectional fin configuration helps to maximize surface contact with the source, allowing for better heat transfer. This design helps to optimize heat transmission from the source to the Thermal - Heat Sink.
The Thermal - Heat Sink’s low thermal resistance design ensures that the ATS-15E-10-C1-R0 can be used in a wide variety of applications. Its advanced thermal engineering principles allow for increased operational temperatures for components and subsystems that require precise thermal management. This makes the Thermal - Heat Sink an ideal solution for applications such as automotive, industrial, medical, and consumer electronics.
The Thermal - Heat Sink can be used in a variety of ways to maximize heat transfer. It can be used to dissipate heat from or to a surface, be used to circulate air to dissipate heat from components, or to absorb sound vibrations caused by components. It can also be used to transfer heat from one point to another, or to dissipate heat from sources such as resistors, capacitors, and transformers.
The Thermal - Heat Sink is designed to effectively and efficiently dissipate heat from a variety of sources, and to protect components and subsystems from excess heat that could cause damage. Due to its advanced design and materials, the Thermal - Heat Sink has been proven to be a reliable and long-term solution for a diverse range of applications. The ATS-15E-10-C1-R0 is perfect for projects that require increased thermal performance and a low acoustic noise level.
The specific data is subject to PDF, and the above content is for reference