ATS-15E-10-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-15E-10-C3-R0-ND

Manufacturer Part#:

ATS-15E-10-C3-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-15E-10-C3-R0 datasheetATS-15E-10-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.57399
30 +: $ 3.37554
50 +: $ 3.17696
100 +: $ 2.97845
250 +: $ 2.77989
500 +: $ 2.58133
1000 +: $ 2.53168
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-15E-10-C3-R0 is a thermal solution designed to help users dissipate heat from their electronics. The device is categorized as a heat sink and is its primary purpose is to conduct heat away from the source and dissipate it into the surrounding environment.

Heat sinks are typically made of metals such as copper, aluminum, or steel. Many of them have fins, channels, or both on their heat-sink surfaces, which enables them to quickly and quietly move heat away from the hot spots on an electronic device. Heat sinks reduce the operating temperature of the component, allowing it to operate more efficiently.

The ATS-15E-10-C3-R0 heat sink has a riveted construction that provides superior bonding strength. It also features a 0.5 mm die back, which helps keep the heat from transferring too quickly while still allowing the heat to dissipate quickly. The heat sink also has a self-leveling design that helps minimize air pockets.

The ATS-15E-10-C3-R0 heat sink is made from a high-temperature, high-conductivity aluminum alloy that helps dissipate the heat without becoming too hot. It also features a thermal conductive coating to further improve heat transfer. This heat sink has a 10 mm thickness and a surface area of 15 cm2, making it ideal for use in electronics that generate high amounts of heat.

The ATS-15E-10-C3-R0 heat sink is designed to be mounted directly to the source of the heat, allowing it to transfer adjacent temperature. It\'s suitable for both forced- and natural-air cooling systems. It also features mounting holes and slots for versatility and ease of installation.

The ATS-15E-10-C3-R0 heat sink is an ideal solution for applications that require effective and efficient heat dissipation performance. With its high-temperature, high-conductivity aluminum alloy construction, excellent thermal conductivity, and robust riveting design, the ATS-15E-10-C3-R0 provides reliable heat transfer in a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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