| Allicdata Part #: | ATS25633-ND |
| Manufacturer Part#: |
ATS-15E-113-C2-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15E-113-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.20040 |
| 10 +: | $ 3.11472 |
| 25 +: | $ 3.03055 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential facet in many fields, with heat sinks acting as one of the most critical components. The ATS-15E-113-C2-R0 heat sink is a superior product that offers a wide range of applications and a unique working principle.
The ATS-15E-113-C2-R0 heat sink is an extremely efficient product that is able to withstand temperatures up to 95 degrees Celsius. It is designed to offer superior thermal dissipation in a wide range of applications, including power electronics, communications equipment, computers, and other electronic equipment.
The heat sink is constructed from an advanced aluminium alloy, making it one of the strongest and most durable heat sinks on the market. The material is precision machined for a perfect fit and can easily dissipate the heat generated by a variety of components. It features an efficient fin design, which ensures optimal cooling and helps to reduce the size of the component.
The ATS-15E-113-C2-R0 heat sink utilizes a unique working principle known as liquid heat-scattering. The process involves liquid coolants being pumped through the heat sink in order to evenly distribute the generated heat and ensure maximum efficiency. This technology helps to reduce device malfunctioning due to high temperatures and has a number of advantages over traditional cooling systems.
The ATS-15E-113-C2-R0 heat sink is designed to be highly efficient in a variety of applications. It can effectively cool components including CPUs, GPUs, ASICs, memory chips, and other electronic components. The heat sink also features a large contact area, allowing it to transfer heat quickly and easily. Additionally, the heat sink is highly resistant to corrosion and is designed to last longer than traditional products.
The ATS-15E-113-C2-R0 heat sink is a superior product for those who require reliable thermal management. Its advanced aluminium alloy construction offers superior durability, while its liquid heat-scattering principle provides excellent heat dissipation and reduces component malfunctioning. This heat sink is an ideal solution for those who need a reliable and efficient heat sink for an array of applications.
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