| Allicdata Part #: | ATS-15E-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-15E-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15E-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for electronic devices to function reliably and efficiently. The most important consideration in thermal management is heat dissipation from each device. The ATS-15E-117-C1-R0 is one type of heat sink designed to provide efficient heat transfer away from the source. This article will explain the application field and working principle of the ATS-15E-117-C1-R0.
Application Field
The ATS-15E-117-C1-R0 is a medium-size heat sink designed primarily for larger high-power devices such as microprocessors and discrete power transistors. This heat sink is suitable for both air and forced-air applications. It is also suitable for applications requiring high static pressures and thermal loads. Additionally, the ATS-15E-117-C1-R0 can be used with airflow levels ranging from 0.02m/s to 0.85m/s.
Working Principle
The ATS-15E-117-C1-R0 is designed to increase static pressure and minimize airflow resistance. The body of the heatsink is made of high-quality aluminum extrusion and is ribbed to extend the heatsink\'s surface area. This increased surface area helps to transfer heat away from the device. The ATS-15E-117-C1-R0 is also designed to improve air convection by creating airflow within the heatsink which cools the heatsink more quickly. The ATS-15E-117-C1-R0 features an optimized fin density which helps to reduce noise levels and increase cooling efficiency. The ATS-15E-117-C1-R0 is designed to provide efficient heat transfer in two ways. First, it draws heat away from the device through conduction. Heat is first transferred from the device to the body of the heatsink. The body then transfers the heat to the fins via natural convection. The fins are designed to maximize surface area for heat transfer to the surrounding air. Second, the ATS-15E-117-C1-R0 features cooling airflow which increases the rate of heat transfer from the fins to the surrounding air. This cooling airflow helps to dissipate heat away from the device.
Conclusion
The ATS-15E-117-C1-R0 is a medium-size heat sink designed primarily for larger high-power devices such as microprocessors and discrete power transistors. This heat sink is suitable for both air and forced-air applications. It is also suitable for applications requiring high static pressure and thermal loads. The ATS-15E-117-C1-R0 is designed to provide efficient heat transfer away from the source and is capable of reducing noise levels and increasing cooling efficiency. This heat sink is an excellent choice for high-power applications that require efficient thermal management.
The specific data is subject to PDF, and the above content is for reference