ATS-15E-124-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.25°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal - Heat Sinks: Thermal- heat sinks are designed to improve the overall thermal performance of a system by dissipating the generated heat from the electronic components. Thermal-heat sinks are designed to spread the heat generated by the electronic components evenly, allowing for cooler operation and an increased lifespan. Different types of thermal-heat sinks are available depending on the specific type of application. What is ATS-15E-124-C3-R0?ATS-15E-124-C3-R0 is a thermal-heat sink designed for use in high power and densely packed electronics systems. The unique design of the ATS-15E-124-C3-R0 enables it to provide superior thermal performance even in the most challenging of applications. The combination of resistance and vertical fins provide excellent heat dispersion, while the stainless steel casing and aluminum fins provide strength and durability.What are the Application Fields of ATS-15E-124-C3-R0?The ATS-15E-124-C3-R0 is well suited to a variety of application fields. It is often used in applications such as power supplies, computer motherboards, CPU’s, servers, gaming systems, and networking equipment. It is also ideal for use in high power industrial electronics, such as motor controllers, high-powered LEDs, and high-powered audio systems.How does ATS-15E-124-C3-R0 Work?The ATS-15E-124-C3-R0 works by absorbing and dissipating the generated heat. The thermal-heat sink uses a combination of resistance and vertical fins to spread the heat generated by the electronic components evenly. The ATS-15E-124-C3-R0 also utilizes a stainless steel casing to provide a strong and durable housing, and aluminum fins to disperse the heat more efficiently. Additionally, the thermal-heat sink uses a unique bracket system to attach the heat sink to electronic components, contributing to the overall efficiency of heat dissipation. Conclusion: The ATS-15E-124-C3-R0 is an excellent thermal-heat sink designed for use in high power and densely packed electronics systems. Its combination of resistance and vertical fins provide excellent heat dispersion, the stainless steel casing and aluminum fins provide strength and durability, and the unique bracket system contributes to the overall efficiency of heat dispersion from the electronic components. The ATS-15E-124-C3-R0 is well suited to a variety of applications such as power supplies, computer motherboards, servers, gaming systems, and networking equipment, and is especially ideal for use in high power industrial electronics.

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