| Allicdata Part #: | ATS-15E-129-C3-R0-ND |
| Manufacturer Part#: |
ATS-15E-129-C3-R0 |
| Price: | $ 4.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15E-129-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.27959 |
| 30 +: | $ 4.04187 |
| 50 +: | $ 3.80419 |
| 100 +: | $ 3.56643 |
| 250 +: | $ 3.32867 |
| 500 +: | $ 3.09091 |
| 1000 +: | $ 3.03147 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.71°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of high power electronic components has become essential in many applications, from high performance industrial equipment to consumer electronics. High power electronic components generate a significant amount of heat during operation. This heat must be dissipated efficiently to protect the component and maintain optimal performance. Heat sinks are designed to absorb and dissipate this heat away from the electronics, helping to keep the temperature of the components within operating tolerance. The ATS-15E-129-C3-R0 is a type of passive heat sink that can be used for the efficient thermal management of high power electronic components.
The ATS-15E-129-C3-R0 is a compact, high-performance heat sink that is designed to provide efficient cooling for a variety of high-powered electronics. The heat sink is constructed from aluminum and features a high-density fin configuration to maximize the surface area exposed to incoming air. The fins are specially designed to provide maximum airflow over the heat sink, allowing it to quickly and effectively dissipate the heat away from the electronic components.
The ATS-15E-129-C3-R0 heat sink is suitable for the cooling of a wide range of electronics, including power transistors, power amplifiers, high-power LEDs, power regulators, and other high power components. The heat sink is capable of dissipating a maximum of 15W of heat, making it an excellent choice for managing the heat of most high power electronic components. The ATS-15E-129-C3-R0 is well-suited for both active and passive cooling applications.
The ATS-15E-129-C3-R0 heat sink features a special thermal design that helps to optimize its performance. The design incorporates a large number of fins that are specially designed to maximize the surface area available for heat disipation. The heat sink also features an innovative mounting bracket system that allows it to be easily installed and securely attached to the electronic component.
The ATS-15E-129-C3-R0 heat sink is designed to provide efficient and effective cooling for a variety of high power components. The combination of its efficient thermal design and its easy mounting system make the ATS-15E-129-C3-R0 an excellent choice for the efficient thermal management of high power electronic components. This type of heat sink is widely used in industries such as automotive, power electronics, consumer electronics, and other applications.
The specific data is subject to PDF, and the above content is for reference